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MC74LCX32MR2

Description
OR Gate, LVC/LCX/Z Series, 4-Func, 2-Input, CMOS, PDSO14, EIAJ, PLASTIC, SOIC-14
Categorylogic    logic   
File Size92KB,4 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
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MC74LCX32MR2 Overview

OR Gate, LVC/LCX/Z Series, 4-Func, 2-Input, CMOS, PDSO14, EIAJ, PLASTIC, SOIC-14

MC74LCX32MR2 Parametric

Parameter NameAttribute value
MakerMotorola ( NXP )
package instructionEIAJ, PLASTIC, SOIC-14
Reach Compliance Codeunknown
seriesLVC/LCX/Z
JESD-30 codeR-PDSO-G14
length10.2 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeOR GATE
Number of functions4
Number of entries2
Number of terminals14
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE
propagation delay (tpd)6.2 ns
Certification statusNot Qualified
Maximum seat height2.05 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
width5.275 mm

MC74LCX32MR2 Related Products

MC74LCX32MR2 MC74LCX32DR2 MC74LCX32DT MC74LCX32DTR2
Description OR Gate, LVC/LCX/Z Series, 4-Func, 2-Input, CMOS, PDSO14, EIAJ, PLASTIC, SOIC-14 LVC/LCX/Z SERIES, QUAD 2-INPUT OR GATE, PDSO14, PLASTIC, SOIC-14 LVC/LCX/Z SERIES, QUAD 2-INPUT OR GATE, PDSO14, PLASTIC, TSSOP-14 LVC/LCX/Z SERIES, QUAD 2-INPUT OR GATE, PDSO14, PLASTIC, TSSOP-14
package instruction EIAJ, PLASTIC, SOIC-14 SOP, TSSOP, TSSOP,
Reach Compliance Code unknown unknown unknown unknown
series LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z
JESD-30 code R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14
length 10.2 mm 8.65 mm 5 mm 5 mm
Load capacitance (CL) 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type OR GATE OR GATE OR GATE OR GATE
Number of functions 4 4 4 4
Number of entries 2 2 2 2
Number of terminals 14 14 14 14
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP SOP TSSOP TSSOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
propagation delay (tpd) 6.2 ns 6.2 ns 6.2 ns 6.2 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 2.05 mm 1.75 mm 1.2 mm 1.2 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2 V 2 V 2 V 2 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING GULL WING GULL WING GULL WING
Terminal pitch 1.27 mm 1.27 mm 0.65 mm 0.65 mm
Terminal location DUAL DUAL DUAL DUAL
width 5.275 mm 3.9 mm 4.4 mm 4.4 mm
Maker Motorola ( NXP ) Motorola ( NXP ) - Motorola ( NXP )
Parts packaging code - SOIC TSSOP TSSOP
Contacts - 14 14 14

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