DIODE 0.2 A, 75 V, SILICON, SIGNAL DIODE, HERMETIC SEALED, GLASS PACKAGE-2, Signal Diode
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | NXP |
package instruction | O-LELF-R2 |
Contacts | 2 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Other features | HIGH SPEED SWITCH |
Shell connection | ISOLATED |
Configuration | SINGLE |
Diode component materials | SILICON |
Diode type | RECTIFIER DIODE |
Maximum forward voltage (VF) | 0.88 V |
JESD-30 code | O-LELF-R2 |
JESD-609 code | e3 |
Humidity sensitivity level | 1 |
Number of components | 1 |
Number of terminals | 2 |
Maximum operating temperature | 200 °C |
Maximum output current | 0.2 A |
Package body material | GLASS |
Package shape | ROUND |
Package form | LONG FORM |
Peak Reflow Temperature (Celsius) | 260 |
Maximum power dissipation | 0.5 W |
Certification status | Not Qualified |
Maximum repetitive peak reverse voltage | 75 V |
Maximum reverse current | 0.05 µA |
Maximum reverse recovery time | 0.004 µs |
surface mount | YES |
Terminal surface | Tin (Sn) |
Terminal form | WRAP AROUND |
Terminal location | END |
Maximum time at peak reflow temperature | 30 |