IC,ANALOG MUX,SINGLE,8-CHANNEL,HC-CMOS,DIP,16PIN,PLASTIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | NXP |
package instruction | DIP, DIP16,.3 |
Reach Compliance Code | unknown |
Analog Integrated Circuits - Other Types | SINGLE-ENDED MULTIPLEXER |
JESD-30 code | R-PDIP-T16 |
JESD-609 code | e0 |
Number of channels | 8 |
Number of functions | 1 |
Number of terminals | 16 |
Maximum on-state resistance (Ron) | 280 Ω |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP16,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 2/6,GND/-6 V |
Certification status | Not Qualified |
Maximum signal current | 0.025 A |
Maximum supply current (Isup) | 0.16 mA |
surface mount | NO |
switch | BREAK-BEFORE-MAKE |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
MC74HC4051N | MC74HC4051DTR2 | |
---|---|---|
Description | IC,ANALOG MUX,SINGLE,8-CHANNEL,HC-CMOS,DIP,16PIN,PLASTIC | IC,ANALOG MUX,SINGLE,8-CHANNEL,HC-CMOS,TSSOP,16PIN,PLASTIC |
Is it Rohs certified? | incompatible | incompatible |
Maker | NXP | NXP |
package instruction | DIP, DIP16,.3 | TSSOP, TSSOP16,.25 |
Reach Compliance Code | unknown | unknown |
Analog Integrated Circuits - Other Types | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
JESD-30 code | R-PDIP-T16 | R-PDSO-G16 |
JESD-609 code | e0 | e0 |
Number of channels | 8 | 8 |
Number of functions | 1 | 1 |
Number of terminals | 16 | 16 |
Maximum on-state resistance (Ron) | 280 Ω | 280 Ω |
Maximum operating temperature | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | TSSOP |
Encapsulate equivalent code | DIP16,.3 | TSSOP16,.25 |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
power supply | 2/6,GND/-6 V | 2/6,GND/-6 V |
Certification status | Not Qualified | Not Qualified |
Maximum signal current | 0.025 A | 0.025 A |
Maximum supply current (Isup) | 0.16 mA | 0.16 mA |
surface mount | NO | YES |
switch | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
technology | CMOS | CMOS |
Temperature level | MILITARY | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | GULL WING |
Terminal pitch | 2.54 mm | 0.635 mm |
Terminal location | DUAL | DUAL |