Standard SRAM, 128KX8, 100ns, CMOS, PDSO32, PLASTIC, SOP-32
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Seiko Epson Corporation |
package instruction | SOP, SOP32,.56 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 100 ns |
I/O type | COMMON |
JESD-30 code | R-PDSO-G32 |
length | 20.5 mm |
memory density | 1048576 bit |
Memory IC Type | STANDARD SRAM |
memory width | 8 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 32 |
word count | 131072 words |
character code | 128000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 128KX8 |
Output characteristics | 3-STATE |
Exportable | YES |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Encapsulate equivalent code | SOP32,.56 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Parallel/Serial | PARALLEL |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 3.05 mm |
Maximum standby current | 0.0001 A |
Minimum standby current | 2 V |
Maximum slew rate | 0.07 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
width | 11.3 mm |
SRM20100LMT10 | SRM20100LTMT85 | SRM20100LCT10 | SRM20100LRMT85 | SRM20100LRMT10 | SRM20100LMT85 | SRM20100LTMT10 | SRM20100LCT85 | |
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Description | Standard SRAM, 128KX8, 100ns, CMOS, PDSO32, PLASTIC, SOP-32 | Standard SRAM, 128KX8, 85ns, CMOS, PDSO32 | Standard SRAM, 128KX8, 100ns, CMOS, PDIP32 | Standard SRAM, 128KX8, 85ns, CMOS, PDSO32 | Standard SRAM, 128KX8, 100ns, CMOS, PDSO32 | Standard SRAM, 128KX8, 85ns, CMOS, PDSO32 | Standard SRAM, 128KX8, 100ns, CMOS, PDSO32 | Standard SRAM, 128KX8, 85ns, CMOS, PDIP32 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum access time | 100 ns | 85 ns | 100 ns | 85 ns | 100 ns | 85 ns | 100 ns | 85 ns |
JESD-30 code | R-PDSO-G32 | R-PDSO-G32 | R-PDIP-T32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDIP-T32 |
memory density | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bi |
Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of ports | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
word count | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
character code | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
organize | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
Exportable | YES | YES | YES | YES | YES | YES | YES | YES |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Minimum standby current | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | YES | NO | YES | YES | YES | YES | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal form | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Maker | Seiko Epson Corporation | - | Seiko Epson Corporation | Seiko Epson Corporation | Seiko Epson Corporation | Seiko Epson Corporation | Seiko Epson Corporation | Seiko Epson Corporation |
Parts packaging code | - | TSOP | DIP | TSOP1 | TSOP1 | SOIC | TSOP | DIP |
Contacts | - | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
Other features | - | BATTERY BACKUP | BATTERY BACKUP | BATTERY BACKUP | BATTERY BACKUP | BATTERY BACKUP | BATTERY BACKUP | BATTERY BACKUP |