IC,SHIFT REGISTER,STD-TTL,DIP,16PIN,CERAMIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | National Semiconductor(TI ) |
package instruction | DIP, DIP16,.3 |
Reach Compliance Code | unknown |
Counting direction | RIGHT |
JESD-30 code | R-XDIP-T16 |
JESD-609 code | e0 |
Number of digits | 8 |
Number of functions | 1 |
Number of terminals | 16 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP16,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Certification status | Not Qualified |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | TTL |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
DM54165J | |
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Description | IC,SHIFT REGISTER,STD-TTL,DIP,16PIN,CERAMIC |
Is it Rohs certified? | incompatible |
Maker | National Semiconductor(TI ) |
package instruction | DIP, DIP16,.3 |
Reach Compliance Code | unknown |
Counting direction | RIGHT |
JESD-30 code | R-XDIP-T16 |
JESD-609 code | e0 |
Number of digits | 8 |
Number of functions | 1 |
Number of terminals | 16 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP16,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Certification status | Not Qualified |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | TTL |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |