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SN74AUC2G06DBVRG4 |
SN74AUC2G06DBVRE4 |
SN74AUC2G06DCKRE4 |
SN74AUC2G06DCKRG4 |
Description |
Buffers & Line Drivers Dual Invrtr Bufr Drvr |
Buffers & Line Drivers Dual Invrtr Bufr Drvr |
Buffers & Line Drivers Dual Invrtr Bufr Drvr |
Buffers & Line Drivers Dual Invrtr Bufr Drvr |
Is it lead-free? |
Lead free |
Lead free |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
Parts packaging code |
SOT-23 |
SOT-23 |
SOIC |
SOIC |
package instruction |
LSSOP, TSOP6,.11,37 |
LSSOP, TSOP6,.11,37 |
TSSOP, TSSOP6,.08 |
TSSOP, TSSOP6,.08 |
Contacts |
6 |
6 |
6 |
6 |
Reach Compliance Code |
unknow |
unknow |
unknow |
unknow |
series |
AUC |
AUC |
AUC |
AUC |
JESD-30 code |
R-PDSO-G6 |
R-PDSO-G6 |
R-PDSO-G6 |
R-PDSO-G6 |
JESD-609 code |
e4 |
e4 |
e4 |
e4 |
length |
2.9 mm |
2.9 mm |
2 mm |
2 mm |
Load capacitance (CL) |
15 pF |
15 pF |
15 pF |
15 pF |
Logic integrated circuit type |
INVERTER |
INVERTER |
INVERTER |
INVERTER |
MaximumI(ol) |
0.005 A |
0.005 A |
0.005 A |
0.005 A |
Humidity sensitivity level |
1 |
1 |
1 |
1 |
Number of functions |
2 |
2 |
2 |
2 |
Number of entries |
1 |
1 |
1 |
1 |
Number of terminals |
6 |
6 |
6 |
6 |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
Output characteristics |
OPEN-DRAIN |
OPEN-DRAIN |
OPEN-DRAIN |
OPEN-DRAIN |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
LSSOP |
LSSOP |
TSSOP |
TSSOP |
Encapsulate equivalent code |
TSOP6,.11,37 |
TSOP6,.11,37 |
TSSOP6,.08 |
TSSOP6,.08 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
method of packing |
TR |
TR |
TR |
TR |
Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
power supply |
1.2/2.5 V |
1.2/2.5 V |
1.2/2.5 V |
1.2/2.5 V |
Prop。Delay @ Nom-Su |
3.3 ns |
3.3 ns |
3.3 ns |
3.3 ns |
propagation delay (tpd) |
3.3 ns |
3.3 ns |
3.3 ns |
3.3 ns |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Schmitt trigger |
NO |
NO |
NO |
NO |
Maximum seat height |
1.45 mm |
1.45 mm |
1.1 mm |
1.1 mm |
Maximum supply voltage (Vsup) |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
Minimum supply voltage (Vsup) |
0.8 V |
0.8 V |
0.8 V |
0.8 V |
Nominal supply voltage (Vsup) |
1.2 V |
1.2 V |
1.2 V |
1.2 V |
surface mount |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Terminal form |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
0.95 mm |
0.95 mm |
0.65 mm |
0.65 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
1.6 mm |
1.6 mm |
1.25 mm |
1.25 mm |
Maker |
Texas Instruments |
Texas Instruments |
Texas Instruments |
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