IC,EPROM,32KX8,CMOS,LDCC,32PIN,PLASTIC
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | STMicroelectronics |
| package instruction | QCCJ, LDCC32,.5X.6 |
| Reach Compliance Code | compliant |
| Maximum access time | 80 ns |
| I/O type | COMMON |
| JESD-30 code | R-PQCC-J32 |
| JESD-609 code | e3 |
| memory density | 262144 bit |
| Memory IC Type | OTP ROM |
| memory width | 8 |
| Number of terminals | 32 |
| word count | 32768 words |
| character code | 32000 |
| Maximum operating temperature | 105 °C |
| Minimum operating temperature | -40 °C |
| organize | 32KX8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC32,.5X.6 |
| Package shape | RECTANGULAR |
| Package form | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Maximum standby current | 0.0001 A |
| Maximum slew rate | 0.03 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Matte Tin (Sn) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
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