16 I/O, PIA-GENERAL PURPOSE, PDIP40, PLASTIC, DIP-40
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | California Micro Devices |
Parts packaging code | DIP |
package instruction | DIP, DIP40,.6 |
Contacts | 40 |
Reach Compliance Code | unknown |
JESD-30 code | R-PDIP-T40 |
JESD-609 code | e0 |
Number of I/O lines | 16 |
Number of ports | 2 |
Number of terminals | 40 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP40,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Maximum slew rate | 4 mA |
Maximum supply voltage | 5.25 V |
Minimum supply voltage | 4.75 V |
Nominal supply voltage | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
uPs/uCs/peripheral integrated circuit type | PARALLEL IO PORT, GENERAL PURPOSE |
G65SC22P2 | G65SC22P1 | G65SC22P3 | G65SC22PE1 | G65SC22PE2 | G65SC22PE3 | G65SC22PE4 | |
---|---|---|---|---|---|---|---|
Description | 16 I/O, PIA-GENERAL PURPOSE, PDIP40, PLASTIC, DIP-40 | 16 I/O, PIA-GENERAL PURPOSE, PDIP40, PLASTIC, DIP-40 | 16 I/O, PIA-GENERAL PURPOSE, PDIP40, PLASTIC, DIP-40 | 16 I/O, PIA-GENERAL PURPOSE, PQCC44, PLASTIC, LCC-44 | 16 I/O, PIA-GENERAL PURPOSE, PQCC44, PLASTIC, LCC-44 | 16 I/O, PIA-GENERAL PURPOSE, PQCC44, PLASTIC, LCC-44 | 16 I/O, PIA-GENERAL PURPOSE, PQCC44, PLASTIC, LCC-44 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | California Micro Devices | California Micro Devices | California Micro Devices | California Micro Devices | California Micro Devices | California Micro Devices | California Micro Devices |
Parts packaging code | DIP | DIP | DIP | LCC | LCC | LCC | LCC |
package instruction | DIP, DIP40,.6 | PLASTIC, DIP-40 | PLASTIC, DIP-40 | QCCJ, LDCC44,.7SQ | PLASTIC, LCC-44 | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ |
Contacts | 40 | 40 | 40 | 44 | 44 | 44 | 44 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 code | R-PDIP-T40 | R-PDIP-T40 | R-PDIP-T40 | S-PQCC-J44 | S-PQCC-J44 | S-PQCC-J44 | S-PQCC-J44 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
Number of I/O lines | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
Number of ports | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
Number of terminals | 40 | 40 | 40 | 44 | 44 | 44 | 44 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | DIP | DIP | QCCJ | QCCJ | QCCJ | QCCJ |
Encapsulate equivalent code | DIP40,.6 | DIP40,.6 | DIP40,.6 | LDCC44,.7SQ | LDCC44,.7SQ | LDCC44,.7SQ | LDCC44,.7SQ |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE | SQUARE |
Package form | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum slew rate | 4 mA | 2 mA | 6 mA | 2 mA | 4 mA | 6 mA | 8 mA |
Maximum supply voltage | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
Minimum supply voltage | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND | J BEND | J BEND |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | QUAD | QUAD | QUAD | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
uPs/uCs/peripheral integrated circuit type | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE |
length | - | - | - | 16.5862 mm | 16.5862 mm | 16.5862 mm | 16.5862 mm |
Maximum seat height | - | - | - | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm |
width | - | - | - | 16.5862 mm | 16.5862 mm | 16.5862 mm | 16.5862 mm |