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EDI788MSV50FI

Description
Flash, 8MX8, 50ns, CDFP24,
Categorystorage    storage   
File Size61KB,2 Pages
ManufacturerEDI [Electronic devices inc.]
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EDI788MSV50FI Overview

Flash, 8MX8, 50ns, CDFP24,

EDI788MSV50FI Parametric

Parameter NameAttribute value
MakerEDI [Electronic devices inc.]
package instruction,
Reach Compliance Codeunknown
Maximum access time50 ns
JESD-30 codeR-CDFP-F24
memory density67108864 bit
Memory IC TypeFLASH
memory width8
Number of functions1
Number of terminals24
word count8388608 words
character code8000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize8MX8
Output characteristics3-STATE
Package body materialCERAMIC, METAL-SEALED COFIRED
Package shapeRECTANGULAR
Package formFLATPACK
Parallel/SerialPARALLEL
Programming voltage3.3 V
Certification statusNot Qualified
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formFLAT
Terminal locationDUAL

EDI788MSV50FI Related Products

EDI788MSV50FI EDI788MSV50BC EDI788MSV50BM EDI788MSV50BI EDI788MSV50BB EDI788MSV50FC
Description Flash, 8MX8, 50ns, CDFP24, Flash, 8MX8, 50ns, CDSO24, Flash, 8MX8, 50ns, CDSO24, Flash, 8MX8, 50ns, CDSO24, Flash, 8MX8, 50ns, CDSO24, Flash, 8MX8, 50ns, CDFP24,
Maker EDI [Electronic devices inc.] EDI [Electronic devices inc.] EDI [Electronic devices inc.] EDI [Electronic devices inc.] EDI [Electronic devices inc.] EDI [Electronic devices inc.]
Reach Compliance Code unknown unknown unknown unknown unknow unknow
Maximum access time 50 ns 50 ns 50 ns 50 ns 50 ns 50 ns
JESD-30 code R-CDFP-F24 R-CDSO-G24 R-CDSO-G24 R-CDSO-G24 R-CDSO-G24 R-CDFP-F24
memory density 67108864 bit 67108864 bit 67108864 bit 67108864 bit 67108864 bi 67108864 bi
Memory IC Type FLASH FLASH FLASH FLASH FLASH FLASH
memory width 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1
Number of terminals 24 24 24 24 24 24
word count 8388608 words 8388608 words 8388608 words 8388608 words 8388608 words 8388608 words
character code 8000000 8000000 8000000 8000000 8000000 8000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 70 °C 125 °C 85 °C 125 °C 70 °C
Minimum operating temperature -40 °C - -55 °C -40 °C -55 °C -
organize 8MX8 8MX8 8MX8 8MX8 8MX8 8MX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE FLATPACK
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Programming voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL MILITARY INDUSTRIAL MILITARY COMMERCIAL
Terminal form FLAT GULL WING GULL WING GULL WING GULL WING FLAT
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL

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