Compander, BIPolar, CDIP16,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) |
| package instruction | DIP, DIP16,.3 |
| Reach Compliance Code | unknown |
| Analog Integrated Circuits - Other Types | COMPANDER |
| JESD-30 code | R-XDIP-T16 |
| JESD-609 code | e0 |
| Number of terminals | 16 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 15 V |
| Certification status | Not Qualified |
| Maximum supply current (Isup) | 4.8 mA |
| Nominal supply voltage (Vsup) | 15 V |
| surface mount | NO |
| technology | BIPOLAR |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| SA571F | NE571D | NE571N | NE570F | NE570N | |
|---|---|---|---|---|---|
| Description | Compander, BIPolar, CDIP16, | Compander, BIPolar, PDSO16, | Compander, BIPolar, PDIP16, | Compander, BIPolar, CDIP16, | Compander, BIPolar, PDIP16, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP16,.3 | SOP, SOP16,.4 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| Analog Integrated Circuits - Other Types | COMPANDER | COMPANDER | COMPANDER | COMPANDER | COMPANDER |
| JESD-30 code | R-XDIP-T16 | R-PDSO-G16 | R-PDIP-T16 | R-XDIP-T16 | R-PDIP-T16 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 16 | 16 | 16 | 16 | 16 |
| Maximum operating temperature | 85 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY |
| encapsulated code | DIP | SOP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP16,.3 | SOP16,.4 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | 15 V | 15 V | 15 V | 15 V | 15 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply current (Isup) | 4.8 mA | 4.8 mA | 4.8 mA | 4.8 mA | 4.8 mA |
| Nominal supply voltage (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V |
| surface mount | NO | YES | NO | NO | NO |
| technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) | - | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
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