The CM1205−08CP is offered in a 10−bump custom Chip Scale Package (CSP). Dimensions are presented below.
Table 5. CSP TAPE AND REEL SPECIFICATIONS
Pocket Size (mm)
Part Number
CM1205−08CP
Chip Size (mm)
3.104 X 1.154 X 0.682
B
0
X A
0
X K
0
3.28 X 1.32 X 0.81
Tape Width
W
8 mm
Reel Diameter
178 mm (7″)
Qty per
Reel
3500
P
0
4 mm
P
1
4 mm
Top
Cover
Tape
P
o
10 Pitches Cumulative
Tolerance On Tape
±0.2
mm
A
o
+
K
o
For Tape Feeder Reference
Only Including Draft,
Concerning around B.
Embossment
B
o
+
+
W
P
1
User Direction of Feed
Center Lines
of Cavity
www.onsemi.com
4
CM1205
PACKAGE DIMENSIONS
WLCSP10, 3.10x1.15
CASE 567BM−01
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
DIM
A
A1
A2
b
D
E
e
MILLIMETERS
MIN
MAX
0.75
0.60
0.23
0.29
0.40 REF
0.34
0.39
3.10 BSC
1.15 BSC
0.65 BSC
D
A
B
2X
2X
0.05 C
0.05 C
0.05 C
0.05 C
NOTE 3
A1
10X
b
B
0.05 C A B
0.03 C
A
1
2
3
4
5
OptiGuard
t
is a trademark of Semiconductor Components Industries, LLC.
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage
may be accessed at
www.onsemi.com/site/pdf/Patent−Marking.pdf.
ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer
is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of
any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and
do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s
technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized
for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices
intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and
hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was
negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright
laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA
Phone:
303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax:
303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email:
orderlit@onsemi.com
N. American Technical Support:
800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
ON Semiconductor Website: www.onsemi.com
Order Literature:
http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
◊
ÉÉÉÉÉÉÉÉ
ÈÈ
ÈÈ
PIN A1
REFERENCE
E
TOP VIEW
A2
OptiGuard Option
A
C
SEATING
PLANE
RECOMMENDED
SOLDERING FOOTPRINT*
A1
PACKAGE
OUTLINE
SIDE VIEW
e
e
0.65
PITCH
10X
0.25
0.65
PITCH
DIMENSIONS: MILLIMETERS
BOTTOM VIEW
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Recently, Chery Automobile Sales Company officially announced that the brand name of Chery's new car S21 is officially determined to be "QQ6", and it will be officially launched in China as early as A...
The digital signal and noise are not much different (amplitude and frequency). Can software algorithms be used to extract the signal and filter out the noise?...
Job Responsibilities:
1. Develop BMS software and system test plans;2. Build battery simulation equipment and HIL test environment, implement test tasks, and complete test reports;3. Develop PACK-leve...
Semiconductor manufacturing is traditionally divided into four processes: design, manufacturing, packaging, and testing. From the perspective of technical content and cost, the design and manufacturin...
Recently, market research firm Counterpoint released a global true wireless headset (TWS) market report, predicting that the TWS headset market will reach 310 million units in 2021, a 33% increase ov...[Details]
Opening remarks:
The return statement is often used in functions with parameter returns. It literally means return. Therefore, many MCU beginners easily overlook the return statement's function of in...[Details]
1. Background introduction An environmental protection bureau in the Yangtze River Basin is responsible for various functional businesses including daily monitoring tasks within the county. However, ...[Details]
With the vigorous development of new energy vehicles, the complexity and importance of motor controllers are increasing. As one of the three core components of new energy vehicles, motor controller...[Details]
C-V2X has always been a big deal but little or no action. Recently, the 96th 3GPP RAN meeting held in Budapest, Hungary was successfully concluded. At this meeting, the 5G Rel-17 standard was announc...[Details]
On the evening of June 30, Tsinghua Unigroup issued an announcement announcing the establishment of the DRAM Business Group, appointing Diao Shijing as the chairman of the DRAM Business Group of Tsin...[Details]
According to the latest news from the upstream supply chain, in addition to developing the next generation of iPhone, Apple is also planning to add new entry-level models to gain more market sh...[Details]
Device Introduction
The XC6371 series is a PWM DC-DC converter, which is manufactured using CMOS processing and laser lithography technology, with low power consumption and high p...[Details]
Panel giant AU Optronics announced its November revenue, which increased by 1.6% month-on-month, setting a new record for the same period in history. Its monthly revenue has remained at NT$30 billion...[Details]
As cars are transformed from a means of transportation to a personalized consumer product that integrates leisure and entertainment, consumers' requirements for car entertainment are constantly incre...[Details]
The circuit has overcharge protection, over-discharge protection, over-current protection and short-circuit protection functions. Its working principle is analyzed as follows:
1 Normal state
...[Details]
Author:
Han Jungang
Time: 2006-02-11 17:08:15 From:
Xi'an University of Posts and Telecommunications ASIC Design Center
Introduction:
Due to the rapid deve...[Details]
On March 21, the Shanghai Stock Exchange disclosed its decision to terminate the review of Shanghai Jingfeng Mingyuan Semiconductor Co., Ltd. (hereinafter referred to as Jingfeng Mingyuan)'s issuance...[Details]
Since Huawei released the Mate60 series of mobile phones in September last year, and now the Pura70 series has been on the market for nearly three months, the specific model of the mobile phone pro...[Details]
Abstract:
A good intelligent connected vehicle in-vehicle service ecosystem can not only promote the healthy development of the intelligent connected vehicle in-vehicle service market, but al...[Details]
Microcontroller MCU
京公网安备 11010802033920号
EEWORLD
