Fast Page DRAM, 256KX1, 120ns, CMOS, PDIP16, 0.300 INCH, PLASTIC, DIP-16
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | AMD |
Parts packaging code | DIP |
package instruction | DIP, DIP16,.3 |
Contacts | 16 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
access mode | FAST PAGE |
Maximum access time | 120 ns |
Other features | RAS ONLY REFRESH |
I/O type | SEPARATE |
JESD-30 code | R-PDIP-T16 |
JESD-609 code | e0 |
memory density | 262144 bit |
Memory IC Type | FAST PAGE DRAM |
memory width | 1 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 16 |
word count | 262144 words |
character code | 256000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 256KX1 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP16,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
refresh cycle | 256 |
Maximum seat height | 5.08 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 7.62 mm |