Microcontroller, 8-Bit, MROM, 8051 CPU, 8MHz, CMOS, PDIP40,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) |
| package instruction | DIP, DIP40,.6 |
| Reach Compliance Code | unknown |
| bit size | 8 |
| CPU series | 8051 |
| JESD-30 code | R-PDIP-T40 |
| JESD-609 code | e0 |
| Number of terminals | 40 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP40,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| RAM (bytes) | 256 |
| rom(word) | 16384 |
| ROM programmability | MROM |
| speed | 8 MHz |
| Maximum slew rate | 28 mA |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | AUTOMOTIVE |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| P83C654EHP/XXX | P83C654EBA/XXX | P83C654EBB/XXX | P83C654EBP/XXX | P83C654EBR/XXX | P83C654EFP/XXX | P83C654EHA/XXX | P83C654EHB/XXX | P83C654EFA/XXX | P83C654EFB/XXX | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | Microcontroller, 8-Bit, MROM, 8051 CPU, 8MHz, CMOS, PDIP40, | Microcontroller, 8-Bit, MROM, 8051 CPU, 8MHz, CMOS, PQCC44, | Microcontroller, 8-Bit, MROM, 8051 CPU, 8MHz, CMOS, PQFP44, | Microcontroller, 8-Bit, MROM, 8051 CPU, 8MHz, CMOS, PDIP40, | Microcontroller, 8-Bit, MROM, 8051 CPU, 8MHz, CMOS, PDIP42, | Microcontroller, 8-Bit, MROM, 8051 CPU, 8MHz, CMOS, PDIP40, | Microcontroller, 8-Bit, MROM, 8051 CPU, 8MHz, CMOS, PQCC44, | Microcontroller, 8-Bit, MROM, 8051 CPU, 8MHz, CMOS, PQFP44, | Microcontroller, 8-Bit, MROM, 8051 CPU, 8MHz, CMOS, PQCC44, | Microcontroller, 8-Bit, MROM, 8051 CPU, 8MHz, CMOS, PQFP44, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP40,.6 | QCCJ, LDCC44,.7SQ | QFP, QFP44,.5SQ,32 | DIP, DIP40,.6 | SDIP, SDIP42,.6 | DIP, DIP40,.6 | QCCJ, LDCC44,.7SQ | QFP, QFP44,.5SQ,32 | QCCJ, LDCC44,.7SQ | QFP, QFP44,.5SQ,32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| bit size | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| CPU series | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 |
| JESD-30 code | R-PDIP-T40 | S-PQCC-J44 | S-PQFP-G44 | R-PDIP-T40 | R-PDIP-T42 | R-PDIP-T40 | S-PQCC-J44 | S-PQFP-G44 | S-PQCC-J44 | S-PQFP-G44 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 40 | 44 | 44 | 40 | 42 | 40 | 44 | 44 | 44 | 44 |
| Maximum operating temperature | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C | 125 °C | 125 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | - | - | - | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | QCCJ | QFP | DIP | SDIP | DIP | QCCJ | QFP | QCCJ | QFP |
| Encapsulate equivalent code | DIP40,.6 | LDCC44,.7SQ | QFP44,.5SQ,32 | DIP40,.6 | SDIP42,.6 | DIP40,.6 | LDCC44,.7SQ | QFP44,.5SQ,32 | LDCC44,.7SQ | QFP44,.5SQ,32 |
| Package shape | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | IN-LINE | CHIP CARRIER | FLATPACK | IN-LINE | IN-LINE, SHRINK PITCH | IN-LINE | CHIP CARRIER | FLATPACK | CHIP CARRIER | FLATPACK |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM (bytes) | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
| rom(word) | 16384 | 16384 | 16384 | 16384 | 16384 | 16384 | 16384 | 16384 | 16384 | 16384 |
| ROM programmability | MROM | MROM | MROM | MROM | MROM | MROM | MROM | MROM | MROM | MROM |
| speed | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz |
| Maximum slew rate | 28 mA | 28 mA | 28 mA | 28 mA | 28 mA | 28 mA | 28 mA | 28 mA | 28 mA | 28 mA |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | YES | NO | NO | NO | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | AUTOMOTIVE | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | AUTOMOTIVE | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | J BEND | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | GULL WING | J BEND | GULL WING |
| Terminal pitch | 2.54 mm | 1.27 mm | 0.8 mm | 2.54 mm | 1.78 mm | 2.54 mm | 1.27 mm | 0.8 mm | 1.27 mm | 0.8 mm |
| Terminal location | DUAL | QUAD | QUAD | DUAL | DUAL | DUAL | QUAD | QUAD | QUAD | QUAD |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) | - | - | - | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
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