INCH-POUND
MIL-M-38510/341F
4 May 2004
SUPERSEDING
MIL-M-38510/341E
28 APRIL 1989
MILITARY SPECIFICATION
MICROCIRCUITS, DIGITAL, BIPOLAR, ADVANCED, SCHOTTKY TTL,
FLIP-FLOPS, CASCADABLE, MONOLITHIC SILICON
Reactivated after 4 May, 2004 and may be used for either new or existing design acquisition.
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
The requirements for acquiring the product herein shall consist of this specification sheet and MIL-PRF 38535
1. SCOPE
1.1 Scope. This specification covers the detail requirements for monolithic silicon, Advanced Schottky TTL, flip
flop microcircuits. Two product assurance classes and a choice of case outlines/lead finish are provided and are
reflected in the complete part number. For this product, the requirements of MIL-M-38510 have been superseded by
MIL-PRF-38535, (see 6.3).
1.2 Part or Identifying Number (PIN). The PIN is in accordance with MIL-PRF-38535, and as specified herein.
1.2.1 Device types. The device types are as follows:
Device type
01
02
03
04
05
06
07
08
09
10
11
Circuit
Dual D-type positive edge-triggered flip-flop
Dual J
K
positive edge triggered flip-flop
Dual JK negative edge-triggered flip-flop
Quad D-type positive edge-triggered flip-flop
Octal D-type positive edge-triggered flip-flop
with three-state outputs
Octal D-type positive edge-triggered flip-flop
with three-state inverted outputs
Hex D-type positive edge-triggered flip-flop
Parallel D-type positive edge-triggered
register (with enable)
Quad parallel D-type positive edge-triggered register (with enable)
Octal D-type positive edge-triggered flip-flop
with three-state outputs and bus structured pinouts
Octal D-type positive edge-triggered flip-flop
with three-state inverted outputs and bus structured pinouts
1.2.2 Device class. The device class is the product assurance level as defined in MIL-PRF-38535.
Comments, suggestions, or questions on this document should be addressed to: Commander, Defense
Supply Center Columbus, ATTN: DSCC-VAS, 3990 East Broad St., Columbus, OH 43216-5000, or emailed to
bipolar@dscc.dla.mil. Since contact information can change, you may want to verify the currency of this
address information using the ASSIST Online database at www.dodssp.daps.mil.
AMSC N/A
FSC 5962
MIL-M-38510/341F
1.2.3 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter
A
B
C
D
E
F
R
S
2
X
Descriptive designator
GDFP5-F14 or CDFP6-F14
GDFP4-F14
GDIP1-T14 or CDIP2-T14
GDFP1-F14 or CDFP2-F14
GDIP1-T16 or CDIP2-T16
GDFP2-F16 or CDFP3-F16
GDIP1-T20 or CDIP2-T20
GDFP2-F20 or CDFP3-F20
CQCC1-N20
CQCC2-N20
Terminals
14
14
14
14
16
16
20
20
20
20
Package style
Flat pack
Flat pack
Dual-in-line
Flat pack
Dual-in-line
Flat pack
Dual-in-line package
Flat pack
Square leadless chip
carrier
Square leadless chip
carrier
1.3 Absolute maximum ratings.
Supply voltage range .............................................................................
Input voltage range ................................................................................
Storage temperature range ....................................................................
Maximum power dissipation, (P
D
) 1/ :
Device type 01 ..................................................................................
Device type 02 ..................................................................................
Device type 03 ..................................................................................
Device type 04 ..................................................................................
Device types 05, 06, 10, 11...............................................................
Device type 07 ..................................................................................
Device type 08 ..................................................................................
Device type 09 ..................................................................................
Lead temperature (soldering, 10 seconds)..............................................
Thermal resistance, junction to case (θ
JC
): (See MIL-STD-1835)
Junction temperature (T
J
) 2/....................................................................
1.4 Recommended operating conditions. 2/
Supply voltage (V
CC
) ..............................................................................
Minimum high-level input voltage (V
IH
) ...................................................
Maximum low-level input voltage (V
IL
) ....................................................
Case operating temperature range (T
C
) ..................................................
Width of clock pulse high:
Device type 01 ..................................................................................
Device type 02 ..................................................................................
Device type 03 ..................................................................................
Device type 04 ..................................................................................
Device type 05 ..................................................................................
Device type 06, 07 ............................................................................
Device type 08 ..................................................................................
Device type 09 ..................................................................................
Device types 10, 11...........................................................................
4.5 V dc minimum to 5.5 V dc maximum
2.0 V dc
0.8 V dc
-55
°C
to +125
°C
4.0 ns minimum
4.0 ns minimum
5.0 ns minimum
4.0 ns minimum
8.0 ns minimum
7.0 ns minimum
4.0 ns minimum
4.0 ns minimum
5.0 ns minimum
-0.5 V dc to +7.0 V dc
-1.2 V dc at -18 mA to +7.0 V dc
-65° to +150°C
88 mW
93.5 mW
105 mW
187 mW
473 mW
247 mW
247 mW
220 mW
+300°C
175°C
______
1/ Must withstand the added P
D
due to short-circuit test (e.g., I
OS
).
2/ Maximum junction temperature should not be exceeded except for allowable short duration burn-in
screening conditions in according with MIL-PRF-38535.
2
MIL-M-38510/341F
Width of clock pulse low:
Device type 01 ..................................................................................
Device type 02 ..................................................................................
Device type 03 ..................................................................................
Device type 04 ..................................................................................
Device type 05 ..................................................................................
Device type 06 ..................................................................................
Device type 07 ..................................................................................
Device type 08 ..................................................................................
Device type 09 ..................................................................................
Device types 10, 11...........................................................................
Width of set pulse:
Device type 01 ..................................................................................
Device type 02 ..................................................................................
Device type 03 ..................................................................................
Width of clear pulse:
Device type 01 ..................................................................................
Device type 02 ..................................................................................
Device type 03 ..................................................................................
Width of master reset pulse:
Device type 04 ..................................................................................
Device type 07 ..................................................................................
Setup time J, K, or D high to clock pulse:
Device type 01 ..................................................................................
Device type 02 ..................................................................................
Device type 03 ..................................................................................
Device type 04 ..................................................................................
Device type 05 ..................................................................................
Device type 06 ..................................................................................
Device type 07 ..................................................................................
Device type 08 ..................................................................................
Device type 09 ..................................................................................
Device type 10 ..................................................................................
Device type 11 ..................................................................................
Setup time J, K, or D low to clock pulse:
Device type 01 ..................................................................................
Device type 02 ..................................................................................
Device type 03 ..................................................................................
Device type 04 ..................................................................................
Device type 05 ..................................................................................
Device type 06 ..................................................................................
Device type 07 ..................................................................................
Device type 08 ..................................................................................
Device type 09 ..................................................................................
Device type 10 ..................................................................................
Device type 11 ..................................................................................
Hold time J, K, or D high to clock pulse:
Device type 01 ..................................................................................
Device type 02 ..................................................................................
Device type 03 ..................................................................................
Device type 04 ..................................................................................
Device types 05, 06, 07.....................................................................
Device type 08 ..................................................................................
Device type 09 ..................................................................................
Device types 10, 11...........................................................................
6.0 ns minimum
5.0 ns minimum
5.0 ns minimum
6.0 ns minimum
8.0 ns minimum
6.0 ns minimum
7.5 ns minimum
5.0 ns minimum
5.0 ns minimum
5.0 ns minimum
4.0 ns minimum
4.0 ns minimum
5.0 ns minimum
4.0 ns minimum
4.0 ns minimum
5.0 ns minimum
5.0 ns minimum
6.5 ns minimum
3.0 ns minimum
3.0 ns minimum
5.0 ns minimum
3.0 ns minimum
2.5 ns minimum
2.0 ns minimum
5.0 ns minimum
4.0 ns minimum
3.0 ns minimum
3.0 ns minimum
2.5 ns minimum
4.0 ns minimum
4.0 ns minimum
2.5 ns minimum
4.0 ns minimum
2.0 ns minimum
2.5 ns minimum
5.0 ns minimum
4.0 ns minimum
3.0 ns minimum
2.5 ns minimum
3.0 ns minimum
2.0 ns minimum
1.0 ns minimum
2.5 ns minimum
1.0 ns minimum
2.0 ns minimum
2.0 ns minimum
1.0 ns minimum
2.0 ns minimum
3
MIL-M-38510/341F
Hold time J, K, or D low to clock pulse:
Device type 01 ..................................................................................
Device type 02 ..................................................................................
Device type 03 ..................................................................................
Device type 04 ..................................................................................
Device types 05, 06...........................................................................
Device type 07, 08 ............................................................................
Device type 09 ..................................................................................
Device types 10, 11...........................................................................
Recovery time SD , CD , or
MR
to CP:
Device type 01 ..................................................................................
Device type 02 ..................................................................................
Device type 03 ..................................................................................
Device type 04 ..................................................................................
Device type 07 ..................................................................................
Input clock frequency:
Device type 01 ..................................................................................
Device type 02, 07 ............................................................................
Device type 03 ..................................................................................
Device type 04 ..................................................................................
Device types 05, 06...........................................................................
Device type 08 ..................................................................................
Device type 09 ..................................................................................
Device types 10, 11...........................................................................
2.0 ns minimum
1.0 ns minimum
0.0 ns minimum
2.0 ns minimum
2.5 ns minimum
2.0 ns minimum
1.0 ns minimum
2.0 ns minimum
3.0 ns minimum
2.0 ns minimum
5.0 ns minimum
6.0 ns minimum
6.0 ns minimum
0-80 MHz
0-70 MHz
0-90 MHz
0-80 MHz
0-60 MHz
0-90 MHz
0-90 MHz
0-60 MHz
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This section
does not include documents cited in other sections of this specification or recommended for additional information or as
examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that
they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this specification, whether or not
they are listed.
2.2 Government documents.
2.2.1 Specifications and Standards. The following specifications and standards form a part of this specification to the
extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or
contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38535 -
Integrated Circuits (Microcircuits) Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883
MIL-STD-1835
-
-
Test Method Standard for Microelectronics.
Interface Standard Electronic Component Case Outlines
(Copies of these documents are available online at
http://assist.daps.dla.mil;quicksearch/
or
www.dodssp.daps.mil
or
from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.3 Order of precedence. In the event of a conflict between the text of this specification and the references cited
herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and
regulations unless a specific exemption has been obtained.
4
MIL-M-38510/341F
3. REQUIREMENTS
3.1 Qualification. Microcircuits furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before contract
award (see 4.3 and 6.4).
3.2 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535 and as
specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM
plan shall not affect the form, fit, or function as described herein.
3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as
specified in MIL-PRF-38535 and herein.
3.3.1 Terminal connections and logic diagrams. The terminal connections and logic diagrams shall be as specified on
figures 1 and 2.
3.3.2 Truth tables. The truth tables and logic equations shall be as specified on figure 3.
3.3.3 Schematic circuits. The schematic circuits shall be maintained by the manufacturer and made available to the
qualifying activity and the preparing activity (DSCC-VAS) upon request.
3.3.4 Case outlines. The case outlines shall be as specified in 1.2.3.
3.4 Lead material and finish. The lead material and finish shall be in accordance with MIL-PRF-38535 (see 6.6).
3.5 Electrical performance characteristics. The electrical performance characteristics are as specified in table I, and
apply over the full recommended case operating temperature range, unless otherwise specified.
3.6 Electrical test requirements. The electrical test requirements for each device class shall be the subgroups
specified in table II. The electrical tests for each subgroup are described in table III.
3.7 Marking. Marking shall be in accordance with MIL-PRF-38535.
3.8 Microcircuit group assignment. The devices covered by this specification shall be in microcircuit group number 10
(see MIL-PRF-38535, appendix A).
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as
modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not effect
the form, fit, or function as described herein.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38535 and shall be conducted on all devices prior to
qualification and quality conformance inspection. The following additional criteria shall apply:
a. The burn-in test duration, test condition, and test temperature, or approved alternatives shall be as specified in
the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be
maintained under document control by the device manufacturer's Technology Review Board (TRB) in
accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon
request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in
accordance with the intent specified in test method 1015 of MIL-STD-883.
b. Interim and final electrical test parameters shall be as specified in table II, except interim electrical parameters
test prior to burn-in is optional at the discretion of the manufacturer.
c. Additional screening for space level product shall be as specified in MIL-PRF-38535, appendix B.
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