Inverter, CMOS, PDIP20
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Philips Semiconductors (NXP Semiconductors N.V.) |
package instruction | DIP, DIP20,.3 |
Reach Compliance Code | unknown |
JESD-30 code | R-PDIP-T20 |
JESD-609 code | e0 |
Load capacitance (CL) | 50 pF |
Logic integrated circuit type | INVERTER |
Number of terminals | 20 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP20,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 2/6 V |
Prop。Delay @ Nom-Sup | 26 ns |
Certification status | Not Qualified |
Schmitt trigger | YES |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
PC74HC9014P | 74HCT9014D | PC74HCT9014T | PC74HC9014T | |
---|---|---|---|---|
Description | Inverter, CMOS, PDIP20 | Inverter, CMOS, PDSO20, | Inverter, CMOS, PDSO20 | Inverter, CMOS, PDSO20 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
Maker | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
package instruction | DIP, DIP20,.3 | SOP, SOP20,.4 | SOP, SOP20,.4 | SOP, SOP20,.4 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
JESD-30 code | R-PDIP-T20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 |
JESD-609 code | e0 | e0 | e0 | e0 |
Logic integrated circuit type | INVERTER | INVERTER | INVERTER | INVERTER |
Number of terminals | 20 | 20 | 20 | 20 |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | SOP | SOP | SOP |
Encapsulate equivalent code | DIP20,.3 | SOP20,.4 | SOP20,.4 | SOP20,.4 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
power supply | 2/6 V | 5 V | 5 V | 2/6 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Schmitt trigger | YES | YES | YES | YES |
surface mount | NO | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL |
Load capacitance (CL) | 50 pF | - | 50 pF | 50 pF |
Prop。Delay @ Nom-Sup | 26 ns | - | 40 ns | 26 ns |