NP276 Series
(Open Top)
Ball Grid Array
(BGA, 1.27mm Pitch)
Specifications
1,000M
W
min. at 100V DC
Insulation Resistance:
Dielectric Withstanding Voltage: 100V AC for 1 minute
30m
W
max. at 10mA/20mV max.
Contact Resistance:
Operating Temperature Range: –55°C to +150°C
–40°C to +170°C
30g per pin approx.
Contact Force:
10,000 insetions
Mating Cycles:
Part Number
(Details)
NP276
Series No.
- 1105 22 - *
-
(*)
No. of Contact Pins
(.AC-types are depopulated
base sockets)
Materials and Finish
Housing: Polyetherimide (PEI), glass-filled
Polyethersulphone (PES), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
Design Number
Positioning Pin Options (see PCB):
Pos. pin 'A'
Pos. pin 'B'
1=
With
With
2=
With
Without
3=
Without
With
4=
Without
Without
Contact Terminal Length and Form
Features
í
Open top type sockets for BGA packages
í
Self contacting structure without upper pressing force (ZIF)
í
Contacting structure to nip the sides of solder balls to lower
damage to the coplanarity of the solder balls
Yamaichi's 2-point Tweezer Contact
IC
Ball
Socket
Base A
Contacts
Socket
Base B
Since the solder balls are touched
by two contacts on each side,
the solder ball damage can be
minimized; additional features
are low actuation force and
compact socket size
We have depopulated versions from existing NP276 base sockets.
As new versions are continually being tooled up we rcommend
to contact Yamaichi for your specific pin count
and matching IC
Applicable Base Socket and IC Dimensions
Part
Number
NP276-11904
NP276-11904-3
NP276-15316
NP276-16951
NP276-25626
NP276-37206
NP276-40009
NP276-59608
NP276-65227
NP276-87318
NP276-110522
Pin
Count
119
119
153
169
256
372
400
596
652
873
1105
IC Dimensions
Pitch
1.27
1.27
1.27
1.27
1.27
1.27
1.27
1.27
1.27
1.27
1.27
Base Sockets
(see page)
2
2
3
4
5
6
7
8
9
10
11
Grid Size
7 x 17
7 x 17
9 x 17
13 x 13
16 x 16
20 x 20
20 x 20
26 x 26
28 x 28
31 x 31
35 x 35
Body Size
14 x 22
14 x 22
14 x 22
17 x 17
21 x 21
27 x 27
27 x 27
35 x 35
37.5 x 37.5
40 x 40
45 x 45
Test & Burn-In
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER
NP276 Series
(Open Top)
Ball Grid Array Base Socket
(BGA, 1.27mm Pitch)
Base Socket NP276-11904
Outline Socket Dimensions (27.00 x 38.00mm)
Grid Size: 7 x 17
NP276-11904
Pin Count
Body Size
119
14 x 22
Base Socket NP276-11094-3
Outline Socket Dimensions (26.40 x 32.20mm)
Grid Size: 7 x 17
NP276-11094-3
3.80
Pin Count
Body Size
119
14 x 22
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER
Test & Burn-In
NP276 Series
(Open Top)
Ball Grid Array Base Socket
(BGA, 1.27mm Pitch)
Base Socket NP276-25626
Outline Socket Dimensions (49.4 x 49.4mm)
49.40
Pin Count
Body Size
Grid Size
256
21.0 x 21.0
16 x 16
Recommended PC Board Layouts
Top View from Socket
Various
Pin Counts
Test & Burn-In
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER
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