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MVUMA160A

Description
Trans Voltage Suppressor Diode, 500W, 160V V(RWM), Unidirectional, 1 Element, Silicon, PLASTIC, ULTRAMITE, 2 PIN
CategoryDiscrete semiconductor    diode   
File Size243KB,4 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

MVUMA160A Overview

Trans Voltage Suppressor Diode, 500W, 160V V(RWM), Unidirectional, 1 Element, Silicon, PLASTIC, ULTRAMITE, 2 PIN

MVUMA160A Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicrosemi
package instructionR-PDSO-R2
Contacts2
Reach Compliance Codeunknown
ECCN codeEAR99
Minimum breakdown voltage178 V
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeTRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 codeR-PDSO-R2
JESD-609 codee0
Maximum non-repetitive peak reverse power dissipation500 W
Number of components1
Number of terminals2
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
polarityUNIDIRECTIONAL
Maximum power dissipation1.08 W
Certification statusNot Qualified
Maximum repetitive peak reverse voltage160 V
surface mountYES
technologyAVALANCHE
Terminal surfaceTIN LEAD
Terminal formWRAP AROUND
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
UMA5.0A thru UMA170CA
U
LTRA
M
ITE™ SURFACE MOUNT 500 Watt
SCOTTSDALE DIVISION
Transient Voltage Suppressor 5.0 to 170 V
DESCRIPTION
These 500 watt transient voltage suppressors offer capabilities only found in larger
packages. They are used for protecting against a variety of transients from inductive
switching environments or lower levels of induced secondary lightning effects of
IEC61000-4-5.
It offers the same size footprint as the popular DO-214AC or
PACKAGE
WWW .
Microsemi
.C
OM
BA package outlines except with a much lower profile height. Its robust
configuration in a “2010” style MELF package prevents damage to extended-
lead terminals and virtually eliminates inductive parasitics from fast rise-time
transients with very short internal/external conduction paths. They a
re also very
effective in protection from ESD or EFT per IEC61000-4-2 and IEC61000-4-4.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
UltraMite™
FEATURES
Available as a unidirectional or bidirectional device
(bidirectional with CA suffix)
Fast response time
Suppresses transients up to 500 W @ 10/1000 µs
(see Figure 1, 2, and 3).
Robust 2010 MELF style flat package configuration
for accurate pick-and-place handling
Fits same small narrow PCB pad layouts as “SMAJ”
packages in JEDEC DO-214AC (or BA)
Very low height profile (approximately 1 mm)
Available on Tape and Reel
Built-in stress relief with similar COE as PC boards
Optional Lead-Free design/finish (UMAF5.0A-170CA)
Options for screening in accordance with MIL-PRF-
19500 for JAN, JANTX, JANTXV, and JANS are
available by adding MQ, MX, MV, or MSP prefixes
respectively to part numbers.
APPLICATIONS / BENEFITS
Protects sensitive components such as IC’s, CMOS,
2
Bipolar, BiCMOS, ECL, DTL, T L, etc.
Protection from switching transients & induced RF
Compliant to IEC61000-4-2 and IEC61000-4-4 for
ESD and EFT protection respectively
Secondary lightning protection per IEC61000-4-5
with 42 Ohms source impedance:
Class 1: UMA5.0 to UMA100A or CA
Class 2: UMA5.0 to UMA51A or CA
Class 3: UMA5.0 to UMA24A or CA
Class 4: UMA5.0 to UMA12A or CA
Secondary lightning protection per IEC61000-4-5
with 12 Ohms source impedance:
Class 1: UMA5.0 to UMA30A or CA
Class 2: UMA5.0 to UMA16A or CA
Virtually zero inductive parasitics with minimal Ldi/dt
voltage overshoots for fast-rise-time transients
MAXIMUM RATINGS
Peak Pulse Power dissipation at 25
º
C: 500 watts at
10/1000 µs (also see Fig 1, 2, and 3)
Impulse repetition rate (duty factor): 0.01%
t
clamping
(0 volts to
V
(BR)
min.): < 100 ps theoretical for
unidirectional and < 5 ns for bidirectional
Operating and Storage temperature: -55
º
C to +150
º
C
Thermal resistance: 50
º
C/W junction to lead, or
115
º
C/W junction to ambient when mounted on FR4
2
PC board (1oz Cu) with recommended 5 mm pads
(see last page)
Steady-State Power: 2.5 watts at T
L
= 25
o
C, or 1.08
watts at T
A
= 25
º
C when mounted on FR4 PC board
with recommended 5 mm
2
footprint pads
Forward Surge Current at 25ºC: 40 amps peak, 8.3
ms half-sine wave. Maximum voltage of 3.50 V
(unidirectional only)
Solder temperatures: 260
º
C for 10 s (maximum)
MECHANICAL AND PACKAGING
FRP substrate material and epoxy under-fill package
meeting UL94V-0
Terminals solder plated (solderable per MIL-STD-
750, Method 2026)
Body marked with part number without UMA prefix
(ie. 05, 15A, 33A, 58, 150CA, etc.)
Cathode designated with band (no band on
bidirectional)
Weight: 0.020 grams (approximate)
Tape & Reel packaging per EIA-481-2 with 12 mm
tape and 3000 units/reel (7 inch) or 10,000 units/reel
(13 inch)
See package dimensions on last page
UMA5.0A – UMA170CA
Copyright
2002
MSCUMA5.0.PDF 10-16-2003 REV B
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
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