EEWORLDEEWORLDEEWORLD

Part Number

Search
 PDF

MWDM1L-15GS-4K1-18L

Description
Interconnection Device
CategoryThe connector    Connector bracket   
File Size176KB,2 Pages
ManufacturerGlenair
Websitehttp://www.glenair.com/
Download Datasheet Parametric View All

MWDM1L-15GS-4K1-18L Overview

Interconnection Device

MWDM1L-15GS-4K1-18L Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerGlenair
Reach Compliance Codecompliant
ConnectorSide1MICRO-D
ConnectorSide2MICRO-D
Connector bracket typeWIRE AND CABLE
structureSOLID
DIN complianceNO
IEC complianceNO
length5.486 mm
MIL complianceNO
Number of conductors2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Rated current3 A
shieldNO
Wire gauge24 AWG
Wire and Cable NamesCABLE ASSEMBLY
Renesas releases three 32-bit smart card microcontrollers
Renesas Technology Corp. has announced the release of three 32-bit smart card microcontroller products - the AE56C, AE57C2, and AE58C1. The products integrate large-capacity EEPROM (Electrically Erasa...
rain MCU
EEWORLD University Hall----MCU Principles and Applications Harbin Institute of Technology
MCU Principles and Applications Harbin Institute of Technology : https://training.eeworld.com.cn/course/5416This book introduces the hardware structure and instruction system of the MCS-51 microcontro...
抛砖引玉 MCU
Electronic engineers, did you take advantage of yesterday's price war?
[align=left]Yesterday, several groups were discussing the continuous price reduction of double-sided board proofing, from 10 yuan to 5 yuan and then to 3 yuan. Of course, the names of two PCB companie...
肖优秀 Talking about work
Qualcomm launches next-generation cellular chipsets designed for the Internet of Things
Qualcomm Incorporated has announced its next-generation modem for Internet of Things (IoT) applications such as asset trackers, health monitors, security systems, smart city sensors and smart meters, ...
朗锐智科 RF/Wirelessly
IDC: Asia-Pacific packaged software market to grow by double digits again this year
[Abstract] Singapore, January 20, 2005 - According to IDC's recent forecast for the packaged software market, the Asia-Pacific (excluding Japan) packaged software market is expected to grow by 10.8% i...
tmily RF/Wirelessly

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号