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M38802E2-XXXSS

Description
Microcontroller, 8-Bit, UVPROM, 8MHz, CMOS, CDIP64, SHRINK, CERAMIC, DIP-64
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,49 Pages
ManufacturerMitsubishi
Websitehttp://www.mitsubishielectric.com/semiconductors/
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M38802E2-XXXSS Overview

Microcontroller, 8-Bit, UVPROM, 8MHz, CMOS, CDIP64, SHRINK, CERAMIC, DIP-64

M38802E2-XXXSS Parametric

Parameter NameAttribute value
MakerMitsubishi
Parts packaging codeDIP
package instructionWSDIP,
Contacts64
Reach Compliance Codeunknown
Has ADCNO
Address bus width
bit size8
boundary scanNO
maximum clock frequency8 MHz
DAC channelNO
DMA channelNO
External data bus width8
FormatFIXED POINT
Integrated cacheNO
JESD-30 codeR-CDIP-T64
low power modeYES
Number of DMA channels
Number of external interrupt devices8
Number of I/O lines46
Number of serial I/Os1
Number of terminals64
Number of timers3
On-chip data RAM width8
On-chip program ROM width8
Maximum operating temperature85 °C
Minimum operating temperature-20 °C
PWM channelNO
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeWSDIP
Package shapeRECTANGULAR
Package formIN-LINE, WINDOW, SHRINK PITCH
Certification statusNot Qualified
RAM (number of words)384
rom(word)8000
ROM programmabilityUVPROM
Maximum seat height5.35 mm
speed8 MHz
Maximum slew rate13 mA
Maximum supply voltage5.5 V
Minimum supply voltage2.7 V
Nominal supply voltage5 V
surface mountNO
technologyCMOS
Temperature levelOTHER
Terminal formTHROUGH-HOLE
Terminal pitch1.778 mm
Terminal locationDUAL
width19.05 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER

M38802E2-XXXSS Related Products

M38802E2-XXXSS M38802M1-XXXSS M38802E2-XXXFS M38802M2-XXXFS M38802M2-XXXSS
Description Microcontroller, 8-Bit, UVPROM, 8MHz, CMOS, CDIP64, SHRINK, CERAMIC, DIP-64 Microcontroller, 8-Bit, MROM, 8MHz, CMOS, CDIP64, SHRINK, CERAMIC, DIP-64 Microcontroller, 8-Bit, UVPROM, 8MHz, CMOS, CQCC64, 0.80 MM PITCH, CERAMIC, LCC-64 Microcontroller, 8-Bit, MROM, 8MHz, CMOS, CQCC64, 0.80 MM PITCH, CERAMIC, LCC-64 Microcontroller, 8-Bit, MROM, 8MHz, CMOS, CDIP64, SHRINK, CERAMIC, DIP-64
Parts packaging code DIP DIP LCC LCC DIP
package instruction WSDIP, WSDIP, WQCCN, WQCCN, WSDIP,
Contacts 64 64 64 64 64
Reach Compliance Code unknown unknown unknown unknown unknown
Has ADC NO NO NO NO NO
bit size 8 8 8 8 8
boundary scan NO NO NO NO NO
maximum clock frequency 8 MHz 8 MHz 8 MHz 8 MHz 8 MHz
DAC channel NO NO NO NO NO
DMA channel NO NO NO NO NO
External data bus width 8 8 8 8 8
Format FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT
Integrated cache NO NO NO NO NO
JESD-30 code R-CDIP-T64 R-CDIP-T64 S-CQCC-N64 S-CQCC-N64 R-CDIP-T64
low power mode YES YES YES YES YES
Number of external interrupt devices 8 8 8 8 8
Number of I/O lines 46 46 46 46 46
Number of serial I/Os 1 1 1 1 1
Number of terminals 64 64 64 64 64
Number of timers 3 3 3 3 3
On-chip data RAM width 8 8 8 8 8
On-chip program ROM width 8 8 8 8 8
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -20 °C -20 °C -20 °C -20 °C -20 °C
PWM channel NO NO NO NO NO
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code WSDIP WSDIP WQCCN WQCCN WSDIP
Package shape RECTANGULAR RECTANGULAR SQUARE SQUARE RECTANGULAR
Package form IN-LINE, WINDOW, SHRINK PITCH IN-LINE, WINDOW, SHRINK PITCH CHIP CARRIER, WINDOW CHIP CARRIER, WINDOW IN-LINE, WINDOW, SHRINK PITCH
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
RAM (number of words) 384 384 384 384 384
rom(word) 8000 4000 8000 8000 8000
ROM programmability UVPROM MROM UVPROM MROM MROM
Maximum seat height 5.35 mm 5.35 mm 3.13 mm 3.13 mm 5.35 mm
speed 8 MHz 8 MHz 8 MHz 8 MHz 8 MHz
Maximum slew rate 13 mA 13 mA 13 mA 13 mA 13 mA
Maximum supply voltage 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V
surface mount NO NO YES YES NO
technology CMOS CMOS CMOS CMOS CMOS
Temperature level OTHER OTHER OTHER OTHER OTHER
Terminal form THROUGH-HOLE THROUGH-HOLE NO LEAD NO LEAD THROUGH-HOLE
Terminal pitch 1.778 mm 1.778 mm 0.8 mm 0.8 mm 1.778 mm
Terminal location DUAL DUAL QUAD QUAD DUAL
width 19.05 mm 19.05 mm 15.6 mm 15.6 mm 19.05 mm
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER
Maker Mitsubishi - Mitsubishi Mitsubishi Mitsubishi

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