Microcontroller, 8-Bit, UVPROM, 8MHz, CMOS, CDIP64, SHRINK, CERAMIC, DIP-64
Parameter Name | Attribute value |
Maker | Mitsubishi |
Parts packaging code | DIP |
package instruction | WSDIP, |
Contacts | 64 |
Reach Compliance Code | unknown |
Has ADC | NO |
Address bus width | |
bit size | 8 |
boundary scan | NO |
maximum clock frequency | 8 MHz |
DAC channel | NO |
DMA channel | NO |
External data bus width | 8 |
Format | FIXED POINT |
Integrated cache | NO |
JESD-30 code | R-CDIP-T64 |
low power mode | YES |
Number of DMA channels | |
Number of external interrupt devices | 8 |
Number of I/O lines | 46 |
Number of serial I/Os | 1 |
Number of terminals | 64 |
Number of timers | 3 |
On-chip data RAM width | 8 |
On-chip program ROM width | 8 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -20 °C |
PWM channel | NO |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | WSDIP |
Package shape | RECTANGULAR |
Package form | IN-LINE, WINDOW, SHRINK PITCH |
Certification status | Not Qualified |
RAM (number of words) | 384 |
rom(word) | 8000 |
ROM programmability | UVPROM |
Maximum seat height | 5.35 mm |
speed | 8 MHz |
Maximum slew rate | 13 mA |
Maximum supply voltage | 5.5 V |
Minimum supply voltage | 2.7 V |
Nominal supply voltage | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | OTHER |
Terminal form | THROUGH-HOLE |
Terminal pitch | 1.778 mm |
Terminal location | DUAL |
width | 19.05 mm |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
M38802E2-XXXSS | M38802M1-XXXSS | M38802E2-XXXFS | M38802M2-XXXFS | M38802M2-XXXSS | |
---|---|---|---|---|---|
Description | Microcontroller, 8-Bit, UVPROM, 8MHz, CMOS, CDIP64, SHRINK, CERAMIC, DIP-64 | Microcontroller, 8-Bit, MROM, 8MHz, CMOS, CDIP64, SHRINK, CERAMIC, DIP-64 | Microcontroller, 8-Bit, UVPROM, 8MHz, CMOS, CQCC64, 0.80 MM PITCH, CERAMIC, LCC-64 | Microcontroller, 8-Bit, MROM, 8MHz, CMOS, CQCC64, 0.80 MM PITCH, CERAMIC, LCC-64 | Microcontroller, 8-Bit, MROM, 8MHz, CMOS, CDIP64, SHRINK, CERAMIC, DIP-64 |
Parts packaging code | DIP | DIP | LCC | LCC | DIP |
package instruction | WSDIP, | WSDIP, | WQCCN, | WQCCN, | WSDIP, |
Contacts | 64 | 64 | 64 | 64 | 64 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
Has ADC | NO | NO | NO | NO | NO |
bit size | 8 | 8 | 8 | 8 | 8 |
boundary scan | NO | NO | NO | NO | NO |
maximum clock frequency | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz |
DAC channel | NO | NO | NO | NO | NO |
DMA channel | NO | NO | NO | NO | NO |
External data bus width | 8 | 8 | 8 | 8 | 8 |
Format | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
Integrated cache | NO | NO | NO | NO | NO |
JESD-30 code | R-CDIP-T64 | R-CDIP-T64 | S-CQCC-N64 | S-CQCC-N64 | R-CDIP-T64 |
low power mode | YES | YES | YES | YES | YES |
Number of external interrupt devices | 8 | 8 | 8 | 8 | 8 |
Number of I/O lines | 46 | 46 | 46 | 46 | 46 |
Number of serial I/Os | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 64 | 64 | 64 | 64 | 64 |
Number of timers | 3 | 3 | 3 | 3 | 3 |
On-chip data RAM width | 8 | 8 | 8 | 8 | 8 |
On-chip program ROM width | 8 | 8 | 8 | 8 | 8 |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C |
PWM channel | NO | NO | NO | NO | NO |
Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | WSDIP | WSDIP | WQCCN | WQCCN | WSDIP |
Package shape | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR |
Package form | IN-LINE, WINDOW, SHRINK PITCH | IN-LINE, WINDOW, SHRINK PITCH | CHIP CARRIER, WINDOW | CHIP CARRIER, WINDOW | IN-LINE, WINDOW, SHRINK PITCH |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM (number of words) | 384 | 384 | 384 | 384 | 384 |
rom(word) | 8000 | 4000 | 8000 | 8000 | 8000 |
ROM programmability | UVPROM | MROM | UVPROM | MROM | MROM |
Maximum seat height | 5.35 mm | 5.35 mm | 3.13 mm | 3.13 mm | 5.35 mm |
speed | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz |
Maximum slew rate | 13 mA | 13 mA | 13 mA | 13 mA | 13 mA |
Maximum supply voltage | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | YES | YES | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | OTHER | OTHER | OTHER | OTHER | OTHER |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | THROUGH-HOLE |
Terminal pitch | 1.778 mm | 1.778 mm | 0.8 mm | 0.8 mm | 1.778 mm |
Terminal location | DUAL | DUAL | QUAD | QUAD | DUAL |
width | 19.05 mm | 19.05 mm | 15.6 mm | 15.6 mm | 19.05 mm |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
Maker | Mitsubishi | - | Mitsubishi | Mitsubishi | Mitsubishi |