MBRF735 thru MBRF7150
Taiwan Semiconductor
CREAT BY ART
FEATURES
- Low power loss, high efficiency
- Guardring for overvoltage protection
- High surge current capability
- UL Recognized File # E-326243
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21 definition
Isolated Schottky Barrier Rectifiers
MECHANICAL DATA
Case:
ITO-220AC
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - halogen-free
Base P/N with prefix "H" on packing code - AEC-Q101 qualified
Terminal:
Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test,
with prefix "H" on packing code meet JESD 201 class 2 whisker test
Polarity:
As marked
Mounting torque:
5 in-lbs maximum
Weight:
1.7 g (approximately)
ITO-220AC
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(T
A
=25℃ unless otherwise noted)
PARAMETER
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
Peak repetitive forward current
(Rated VR, Square wave, 20KHz)
Peak forward surge current, 8.3 ms single half
sine-wave superimposed on rated load
Peak repetitive reverse surge current (Note 1)
Maximum instantaneous forward voltage (Note 2)
I
F
=7.5A, T
J
=25℃
I
F
=7.5A, T
J
=125℃
I
F
=15A, T
J
=25℃
I
F
=15A, T
J
=125℃
Maximum reverse current @ Rated V
R
Voltage rate of change (Rated V
R
)
Typical thermal resistance
Operating junction temperature range
Storage temperature range
Note 1: tp = 2.0
μs,
1.0KHz
Note 2: Pulse test with PW=300μs, 1% duty cycle
T
J
=25
℃
T
J
=125
℃
SYMBOL
V
RRM
V
RMS
V
DC
I
F(AV)
I
FRM
I
FSM
I
RRM
1.0
-
V
F
0.57
0.84
0.72
I
R
dV/dt
R
θJC
T
J
T
STG
15
0.75
0.65
-
-
0.1
10
10000
7
- 55 to +150
- 55 to +175
5
MBRF MBRF MBRF MBRF MBRF MBRF MBRF
735
35
24
35
745
45
31
45
750
50
35
50
760
60
42
60
7.5
15
150
0.5
0.92
0.82
-
-
1.02
0.92
-
-
mA
V/μs
O
790
90
63
90
7100
100
70
100
7150
150
105
150
UNIT
V
V
V
A
A
A
A
V
C/W
O
O
C
C
Document Number: DS_D1309005
Version: I13
MBRF735 thru MBRF7150
Taiwan Semiconductor
CREAT BY ART
ORDERING INFORMATION
PART NO.
MBRF7xx
(Note 1)
AEC-Q101
QUALIFIED
Prefix "H"
PACKING CODE
C0
GREEN COMPOUND
CODE
Suffix "G"
PACKAGE
ITO-220AC
PACKING
50 / Tube
Note 1: "xx" defines voltage from 35V (MBRF735) to 150V (MBRF7150)
EXAMPLE
PREFERRED P/N
MBRF760 C0
MBRF760 C0G
MBRF760HC0
PART NO.
MBRF760
MBRF760
MBRF760
H
AEC-Q101
QUALIFIED
PACKING CODE
C0
C0
C0
G
Green compound
AEC-Q101 qualified
GREEN
COMPOUND
DESCRIPTION
RATINGS AND CHARACTERISTICS CURVES
(TA=25℃ unless otherwise noted)
FIG.1- FORWARD CURRENT DERATING CURVE
10
8
6
4
2
0
0
50
100
(
o
C)
150
CASE TEMPERATURE
RESISTIVE OR
INDUCTIVELOAD
WITH HEAT SINK
MBRF735-MBRF745
MBRF750-MBRF7150
PEAK FORWARD SURGE CURRENT (A)
175
150
125
100
75
50
25
1
FIG. 2- MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
AVERAGE FORWARD
A
CURRENT (A)
8.3ms Single Half Sine Wave
JEDEC Method
10
NUMBER OF CYCLES AT 60 Hz
100
FIG. 3- TYPICAL INSTANTANEOUS FORWARD
CHARACTERISTICS
100
Pulse Width=300μs
1% Duty Cycle
INSTANTANEOUS FORWARD CURRENT (A)
INSTANTANEOUS REVERSE CURRENT (mA)
FIG. 4- TYPICAL REVERSE CHARACTERISTICS
100
MBRF735-MBRF745
MBRF750-MBRF7150
10
10
TJ=125℃
TJ=125℃
1
MBRF7150
1
TJ=25℃
0.1
TJ=75℃
0.1
MBRF735-MBRF745
MBRF750-MBRF760
MBRF790-MBRF7100
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
FORWARD VOLTAGE (V)
1
1.1 1.2
0.01
TJ=25℃
0.001
0
20
40
60
80
100
120
140
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
0.01
Document Number: DS_D1309005
Version: I13
MBRF735 thru MBRF7150
Taiwan Semiconductor
CREAT BY ART
FIG. 5- TYPICAL JUNCTION CAPACITANCE
TRANSIENT THERMAL IMPEDANCE (℃/W)
10000
JUNCTION CAPACITANCE (pF)
A
f=1.0MHz
Vsig=50mVp-p
100
FIG. 6- TYPICAL TRANSIENT THERMAL
CHARACTERISTICS
1000
10
100
MBRF735-MBRF745
MBRF750-MBRF760
MBRF790-MBRF7150
1
10
0.1
0.1
0.01
0.1
1
10
100
T-PULSE DURATION (sec)
1
10
100
REVERSE VOLTAGE (V)
PACKAGE OUTLINE DIMENSIONS
Unit (mm)
Min
4.30
2.50
2.30
0.46
6.30
9.60
3.00
0.00
0.95
0.50
2.40
14.80
-
-
12.60
4.95
Max
4.70
3.10
2.90
0.76
6.90
10.30
3.40
1.60
1.45
0.90
3.20
15.50
4.10
1.80
13.80
5.20
Unit (inch)
Min
0.169
0.098
0.091
0.018
0.248
0.378
0.118
0.000
0.037
0.020
0.094
0.583
-
-
0.496
0.195
Max
0.185
0.122
0.114
0.030
0.272
0.406
0.134
0.063
0.057
0.035
0.126
0.610
0.161
0.071
0.543
0.205
DIM.
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
MARKING DIAGRAM
P/N
G
YWW
F
= Specific Device Code
= Green Compound
= Date Code
= Factory Code
Document Number: DS_D1309005
Version: I13
MBRF735 thru MBRF7150
Taiwan Semiconductor
CREAT BY ART
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1309005
Version: I13
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