AM8279-5PCB datasheet, PDF - EEWORLD Datasheet

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AM8279-5PCB: DescriptionMicroprocessor Circuit, MOS, PDIP40,; CategoryThe embedded processor and controller Microcontrollers and processors; File Size221KB，4 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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AM8279-5PCB Overview

Microprocessor Circuit, MOS, PDIP40,

AM8279-5PCB Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DIP, DIP40,.6
Reach Compliance Code	unknow
JESD-30 code	R-PDIP-T40
JESD-609 code	e0
Number of terminals	40
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP40,.6
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Nominal supply voltage	5 V
surface mount	NO
technology	MOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT
Base Number Matches	1

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Description	Microprocessor Circuit, MOS, PDIP40,	Microprocessor Circuit, MOS, CDIP40,	Microprocessor Circuit, MOS, CDIP40,	Microprocessor Circuit, MOS, CDIP40,	Microprocessor Circuit, MOS, CDIP40,	Microprocessor Circuit, MOS, CDIP40	Microprocessor Circuit, MOS, CDIP40	Microprocessor Circuit, MOS, CDIP40	Microprocessor Circuit, MOS, PDIP40
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP40,.6	DIP, DIP40,.6	DIP, DIP40,.6	DIP, DIP40,.6	DIP, DIP40,.6	DIP, DIP40,.6	DIP, DIP40,.6	DIP, DIP40,.6	DIP, DIP40,.6
Reach Compliance Code	unknow	unknow	unknow	unknow	unknow	unknown	unknown	unknown	unknown
JESD-30 code	R-PDIP-T40	R-XDIP-T40	R-XDIP-T40	R-XDIP-T40	R-XDIP-T40	R-XDIP-T40	R-XDIP-T40	R-XDIP-T40	R-PDIP-T40
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0
Number of terminals	40	40	40	40	40	40	40	40	40
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
Package body material	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP40,.6	DIP40,.6	DIP40,.6	DIP40,.6	DIP40,.6	DIP40,.6	DIP40,.6	DIP40,.6	DIP40,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO	NO	NO	NO
technology	MOS	MOS	MOS	MOS	MOS	MOS	MOS	MOS	MOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT
Base Number Matches	1	1	1	1	1	1	1	1	-

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