SRAM Module, 16KX4, 25ns, CMOS
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Twilight Technology Inc. |
package instruction | DIP, DIP22,.4 |
Reach Compliance Code | unknown |
ECCN code | 3A001.A.2.C |
Maximum access time | 25 ns |
I/O type | COMMON |
JESD-30 code | R-XDMA-T22 |
memory density | 65536 bit |
Memory IC Type | SRAM MODULE |
memory width | 4 |
Number of functions | 1 |
Number of terminals | 22 |
word count | 16384 words |
character code | 16000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 16KX4 |
Output characteristics | 3-STATE |
Package body material | UNSPECIFIED |
encapsulated code | DIP |
Encapsulate equivalent code | DIP22,.4 |
Package shape | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Filter level | MIL-STD-883 Class B (Modified) |
Maximum standby current | 0.0013 A |
Minimum standby current | 2 V |
Maximum slew rate | 0.235 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |