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SST55LC100M-45-C-BWE |
SST55LC100M-45-I-TQWE |
SST55LC100M-45-C-TQWE |
SST55LC100M-45-I-BWE |
Description |
IDE COMPATIBLE, FLASH MEMORY DRIVE CONTROLLER, PBGA84, 9 X 9 MM, ROHS COMPLIANT, TFBGA-84 |
IDE COMPATIBLE, FLASH MEMORY DRIVE CONTROLLER, PQFP100, 16 X 16MM, ROHS COMPLIANT, TQFP-100 |
IDE COMPATIBLE, FLASH MEMORY DRIVE CONTROLLER, PQFP100, 16 X 16MM, ROHS COMPLIANT, TQFP-100 |
IDE COMPATIBLE, FLASH MEMORY DRIVE CONTROLLER, PBGA84, 9 X 9 MM, ROHS COMPLIANT, TFBGA-84 |
Is it lead-free? |
Lead free |
Lead free |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
Parts packaging code |
BGA |
QFP |
QFP |
BGA |
package instruction |
TFBGA, |
TFQFP, |
TFQFP, |
TFBGA, |
Contacts |
84 |
100 |
100 |
84 |
Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
Drive interface standards |
IDE |
IDE |
IDE |
IDE |
External data bus width |
16 |
16 |
16 |
16 |
Maximum host data transfer rate |
10 MBps |
10 MBps |
10 MBps |
10 MBps |
Host interface standard |
ATA |
ATA |
ATA |
ATA |
JESD-30 code |
S-PBGA-B84 |
S-PQFP-G100 |
S-PQFP-G100 |
S-PBGA-B84 |
JESD-609 code |
e1 |
e3 |
e3 |
e1 |
length |
9 mm |
14 mm |
14 mm |
9 mm |
Number of terminals |
84 |
100 |
100 |
84 |
Maximum operating temperature |
70 °C |
85 °C |
70 °C |
85 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
TFBGA |
TFQFP |
TFQFP |
TFBGA |
Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
Package form |
GRID ARRAY, THIN PROFILE, FINE PITCH |
FLATPACK, THIN PROFILE, FINE PITCH |
FLATPACK, THIN PROFILE, FINE PITCH |
GRID ARRAY, THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
1.2 mm |
1.2 mm |
1.2 mm |
1.2 mm |
Maximum supply voltage |
3.465 V |
3.465 V |
3.465 V |
3.465 V |
Minimum supply voltage |
3.135 V |
3.135 V |
3.135 V |
3.135 V |
Nominal supply voltage |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
surface mount |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
COMMERCIAL |
INDUSTRIAL |
COMMERCIAL |
INDUSTRIAL |
Terminal surface |
TIN SILVER COPPER |
MATTE TIN |
MATTE TIN |
TIN SILVER COPPER |
Terminal form |
BALL |
GULL WING |
GULL WING |
BALL |
Terminal pitch |
0.8 mm |
0.5 mm |
0.5 mm |
0.8 mm |
Terminal location |
BOTTOM |
QUAD |
QUAD |
BOTTOM |
Maximum time at peak reflow temperature |
40 |
40 |
40 |
40 |
width |
9 mm |
14 mm |
14 mm |
9 mm |
uPs/uCs/peripheral integrated circuit type |
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE |
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE |
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE |
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE |
Maker |
Microchip |
- |
Microchip |
Microchip |