Field Programmable Gate Array, 24576 CLBs, 1000000 Gates, 350MHz, CMOS, PBGA256, 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Microsemi |
package instruction | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 |
Reach Compliance Code | unknown |
maximum clock frequency | 350 MHz |
JESD-30 code | S-PBGA-B256 |
JESD-609 code | e0 |
length | 17 mm |
Humidity sensitivity level | 3 |
Configurable number of logic blocks | 24576 |
Equivalent number of gates | 1000000 |
Number of terminals | 256 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 24576 CLBS, 1000000 GATES |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Package shape | SQUARE |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | 225 |
Programmable logic type | FIELD PROGRAMMABLE GATE ARRAY |
Certification status | Not Qualified |
Maximum seat height | 1.8 mm |
Maximum supply voltage | 1.575 V |
Minimum supply voltage | 1.425 V |
Nominal supply voltage | 1.5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | TIN LEAD/TIN LEAD SILVER |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 30 |
width | 17 mm |