SN74LS181J datasheet, PDF - EEWORLD Datasheet

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SN74LS181J: DescriptionArithmetic Logic Unit, TTL, CDIP24; Categorylogic logic; File Size462KB，8 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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SN74LS181J Overview

Arithmetic Logic Unit, TTL, CDIP24

SN74LS181J Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	AMD
package instruction	DIP, DIP24,.6
Reach Compliance Code	unknown
JESD-30 code	R-XDIP-T24
JESD-609 code	e0
Logic integrated circuit type	ARITHMETIC LOGIC UNIT
Number of terminals	24
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.6
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	TTL
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

SN74LS181J Related Products

	SN74LS181J	SN54LS181JB	SN74LS181NB	SN74LS181NT	SN74LS181JTB	SN74LS181JT	SN54LS181W
Description	Arithmetic Logic Unit, TTL, CDIP24	Arithmetic Logic Unit, TTL, CDIP24	Arithmetic Logic Unit, TTL, PDIP24	Arithmetic Logic Unit, TTL, PDIP24	Arithmetic Logic Unit, TTL, CDIP24	Arithmetic Logic Unit, TTL, CDIP24	Arithmetic Logic Unit, TTL, CDFP24
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-XDIP-T24	R-XDIP-T24	R-PDIP-T24	R-PDIP-T24	R-XDIP-T24	R-XDIP-T24	R-XDFP-F24
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
Logic integrated circuit type	ARITHMETIC LOGIC UNIT	ARITHMETIC LOGIC UNIT	ARITHMETIC LOGIC UNIT	ARITHMETIC LOGIC UNIT	ARITHMETIC LOGIC UNIT	ARITHMETIC LOGIC UNIT	ARITHMETIC LOGIC UNIT
Number of terminals	24	24	24	24	24	24	24
Maximum operating temperature	70 °C	125 °C	70 °C	70 °C	70 °C	70 °C	125 °C
Package body material	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DFP
Encapsulate equivalent code	DIP24,.6	DIP24,.6	DIP24,.6	DIP24,.6	DIP24,.6	DIP24,.6	FL24,.4
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	FLATPACK
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO	YES
technology	TTL	TTL	TTL	TTL	TTL	TTL	TTL
Temperature level	COMMERCIAL	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	FLAT
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maker	AMD	AMD	-	-	AMD	AMD	AMD
package instruction	DIP, DIP24,.6	-	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6	DFP, FL24,.4
Certification status	Not Qualified	Not Qualified	-	Not Qualified	-	Not Qualified	Not Qualified

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