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MT48LC8M32LFF5-75

Description
Synchronous DRAM, 8MX32, 6ns, CMOS, PBGA90, 8 X 13 MM, VFBGA-90
Categorystorage    storage   
File Size2MB,75 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
Download Datasheet Parametric View All

MT48LC8M32LFF5-75 Overview

Synchronous DRAM, 8MX32, 6ns, CMOS, PBGA90, 8 X 13 MM, VFBGA-90

MT48LC8M32LFF5-75 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMicron Technology
Parts packaging codeBGA
package instruction8 X 13 MM, VFBGA-90
Contacts90
Reach Compliance Codeunknown
ECCN codeEAR99
access modeFOUR BANK PAGE BURST
Maximum access time6 ns
Other featuresAUTO/SELF REFRESH
Maximum clock frequency (fCLK)133 MHz
I/O typeCOMMON
interleaved burst length1,2,4,8
JESD-30 codeR-PBGA-B90
JESD-609 codee0
length13 mm
memory density268435456 bit
Memory IC TypeSYNCHRONOUS DRAM
memory width32
Number of functions1
Number of ports1
Number of terminals90
word count8388608 words
character code8000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize8MX32
Package body materialPLASTIC/EPOXY
encapsulated codeVFBGA
Encapsulate equivalent codeBGA90,9X15,32
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)235
power supply3.3 V
Certification statusNot Qualified
refresh cycle4096
Maximum seat height1 mm
self refreshYES
Continuous burst length1,2,4,8,FP
Maximum standby current0.00001 A
Maximum slew rate0.255 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width8 mm
256Mb: x32 Mobile SDRAM
Features
Mobile SDRAM
MT48LC8M32LF, MT48V8M32LF, MT48H8M32LF - 2 Meg x 32 x 4 banks
For the latest data sheet, refer to Micron’s Web site:
www.micron.com/products/dram/mobile
Features
Low voltage power supply
Partial array self refresh power-saving mode
Temperature Compensated Self Refresh (TCSR)
Deep power-down mode
Programmable output drive strength
Fully synchronous; all signals registered on positive
edge of system clock
Internal pipelined operation; column address can
be changed every clock cycle
Internal banks for hiding row access/precharge
Programmable burst lengths: 1, 2, 4, 8, or full page
Auto precharge, includes concurrent auto
precharge, and auto refresh modes
Self-refresh mode; standard and low power
64ms, 4,096-cycle refresh
LVTTL-compatible inputs and outputs
Commercial and industrial temperature ranges
Supports CAS latency of 1, 2, 3
Options
• V
DD
/V
DD
Q
• 3.3V/3.3V
• 2.5V/2.5V
• 1.8V/1.8V
• Configurations
• 8 Meg x 32 (2 Meg x 32 x 4 banks)
• Package/Ballout
• 90-ball VFBGA (8mm x 13mm)
(Standard)
• 90-ball VFBGA (8mm x 13mm)
(Lead-free)
• Timing (Cycle Time)
• 7.5ns @ CL = 3 (133 MHz)
• 7.5ns @ CL = 2 (104 MHz)
• 8ns @ CL = 3 (125 MHz)
• 8ns @ CL = 2 (104 Mhz)
• 10ns @ CL = 3 (100 MHz)
• 10ns @ CL = 2 (83 Mhz)
• Operating Temperature Range
• Commercial (0° to +70°C)
• Industrial (-40°C to +85°C)
Marking
LC
V
H
8M32
F5
B5
-75
-75
-8
-8
-10
-10
None
IT
Table 1: Addressing
8 Meg x 32
Configuration
Refresh Count
Row Addressing
Bank Addressing
Column Addressing
2 Meg x 32 x 4 banks
4K
4K (A0–A11)
4 (BA0, BA1)
512 (A0–A8)
Table 2: Key Timing Parameters
CL = CAS (READ) latency
Speed
Grade
-75
-8
-10
-75
-8
-10
Clock
Frequency
133 MHz
125 MHz
100 MHz
133 MHz
104 MHz
83 MHz
Access Time
CL = 2
7ns
8ns
8ns
CL = 3
6ns
7ns
7ns
-
Setup
Time
2.5ns
2.5ns
2.5ns
2.5ns
2.5ns
2.5ns
Hold
Time
1ns
1ns
1ns
1ns
1ns
1ns
PDF: 09005aef80d460f2/Source: 09005aef80cd8d41
256Mb SDRAM x32_1.fm - Rev. G 6/05
1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.

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