MT58LC32K32B2LG-14P datasheet, PDF

MT58LC32K32B2LG-14P: DescriptionStandard SRAM, 32KX32, 14ns, CMOS, PQFP100, 14 X 20 MM, PLASTIC, TQFP-100; Categorystorage storage; File Size549KB，15 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/

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MT58LC32K32B2LG-14P Overview

Standard SRAM, 32KX32, 14ns, CMOS, PQFP100, 14 X 20 MM, PLASTIC, TQFP-100

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Micron Technology
Parts packaging code	QFP
package instruction	14 X 20 MM, PLASTIC, TQFP-100
Contacts	100
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	14 ns
Other features	OPTIONAL INTERLEAVED OR LINEAR BURST; BYTE WRITE CONTROL; SELF TIMED WRITE CYCLE
I/O type	COMMON
JESD-30 code	R-PQFP-G100
JESD-609 code	e0
length	20 mm
memory density	1048576 bit
Memory IC Type	STANDARD SRAM
memory width	32
Number of functions	1
Number of ports	1
Number of terminals	100
word count	32768 words
character code	32000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32KX32
Output characteristics	3-STATE
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LQFP
Encapsulate equivalent code	QFP100,.63X.87
Package shape	RECTANGULAR
Package form	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	1.6 mm
Maximum standby current	0.002 A
Minimum standby current	3.14 V
Maximum slew rate	0.225 mA
Maximum supply voltage (Vsup)	3.465 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm

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