16-BIT, 24MHz, MICROCONTROLLER, PQFP80, PLASTIC, QFP-80
Parameter Name | Attribute value |
Maker | STMicroelectronics |
Parts packaging code | QFP |
package instruction | PLASTIC, QFP-80 |
Contacts | 80 |
Reach Compliance Code | compliant |
Has ADC | NO |
Other features | CAPTURE/COMPARE UNIT; BANK SWITCH |
Address bus width | 16 |
bit size | 16 |
boundary scan | NO |
maximum clock frequency | 24 MHz |
DAC channel | NO |
DMA channel | YES |
External data bus width | 8 |
Format | FIXED POINT |
Integrated cache | NO |
JESD-30 code | R-PQFP-G80 |
low power mode | YES |
Number of DMA channels | 10 |
Number of external interrupt devices | 9 |
Number of I/O lines | 66 |
Number of serial I/Os | 3 |
Number of terminals | 80 |
Number of timers | 4 |
On-chip data RAM width | 8 |
On-chip program ROM width | |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
PWM channel | NO |
Package body material | PLASTIC/EPOXY |
encapsulated code | QFP |
Package shape | RECTANGULAR |
Package form | FLATPACK |
Certification status | Not Qualified |
RAM (number of words) | 224 |
rom(word) | 0 |
speed | 24 MHz |
Maximum slew rate | 40 mA |
Maximum supply voltage | 5.5 V |
Minimum supply voltage | 4.5 V |
Nominal supply voltage | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | GULL WING |
Terminal location | QUAD |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
ST90R51Q1 | ST90R50C6 | ST90R50Q1 | |
---|---|---|---|
Description | 16-BIT, 24MHz, MICROCONTROLLER, PQFP80, PLASTIC, QFP-80 | 16-BIT, 24MHz, MICROCONTROLLER, PQCC84, PLASTIC, LCC-84 | 16-BIT, 24MHz, MICROCONTROLLER, PQFP80, PLASTIC, QFP-80 |
Maker | STMicroelectronics | STMicroelectronics | STMicroelectronics |
Parts packaging code | QFP | LCC | QFP |
package instruction | PLASTIC, QFP-80 | PLASTIC, LCC-84 | PLASTIC, QFP-80 |
Contacts | 80 | 84 | 80 |
Reach Compliance Code | compliant | not_compliant | not_compliant |
Has ADC | NO | YES | YES |
Other features | CAPTURE/COMPARE UNIT; BANK SWITCH | CAPTURE/COMPARE UNIT; BANK SWITCH | CAPTURE/COMPARE UNIT; BANK SWITCH |
Address bus width | 16 | 16 | 16 |
bit size | 16 | 16 | 16 |
boundary scan | NO | NO | NO |
maximum clock frequency | 24 MHz | 24 MHz | 24 MHz |
DAC channel | NO | NO | NO |
DMA channel | YES | YES | YES |
External data bus width | 8 | 8 | 8 |
Format | FIXED POINT | FIXED POINT | FIXED POINT |
Integrated cache | NO | NO | NO |
JESD-30 code | R-PQFP-G80 | S-PQCC-J84 | R-PQFP-G80 |
low power mode | YES | YES | YES |
Number of DMA channels | 10 | 10 | 10 |
Number of external interrupt devices | 9 | 9 | 9 |
Number of I/O lines | 66 | 72 | 68 |
Number of serial I/Os | 3 | 3 | 3 |
Number of terminals | 80 | 84 | 80 |
Number of timers | 4 | 4 | 4 |
On-chip data RAM width | 8 | 8 | 8 |
Maximum operating temperature | 70 °C | 85 °C | 70 °C |
PWM channel | NO | NO | NO |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | QFP | QCCJ | QFP |
Package shape | RECTANGULAR | SQUARE | RECTANGULAR |
Package form | FLATPACK | CHIP CARRIER | FLATPACK |
Certification status | Not Qualified | Not Qualified | Not Qualified |
RAM (number of words) | 224 | 224 | 224 |
speed | 24 MHz | 24 MHz | 24 MHz |
Maximum slew rate | 40 mA | 70 mA | 40 mA |
Maximum supply voltage | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage | 5 V | 5 V | 5 V |
surface mount | YES | YES | YES |
technology | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
Terminal form | GULL WING | J BEND | GULL WING |
Terminal location | QUAD | QUAD | QUAD |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
Is it Rohs certified? | - | incompatible | incompatible |
CPU series | - | ST9 | ST9 |
JESD-609 code | - | e0 | e0 |
Encapsulate equivalent code | - | LDCC84,1.2SQ | QFP80,.7X.9,32 |
Peak Reflow Temperature (Celsius) | - | NOT SPECIFIED | NOT SPECIFIED |
power supply | - | 5 V | 5 V |
RAM (bytes) | - | 224 | 224 |
Terminal surface | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal pitch | - | 1.27 mm | 0.8 mm |
Maximum time at peak reflow temperature | - | NOT SPECIFIED | NOT SPECIFIED |