Power Supply Support Circuit, Fixed, 1 Channel, +4.37/4.62VV, CMOS, PDIP8, DIP-8
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | California Micro Devices |
Parts packaging code | DIP |
package instruction | DIP, DIP8,.3 |
Contacts | 8 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Adjustable threshold | NO |
Analog Integrated Circuits - Other Types | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 code | R-PDIP-T8 |
JESD-609 code | e0 |
Number of channels | 1 |
Number of functions | 1 |
Number of terminals | 8 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP8,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Maximum supply current (Isup) | 2 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Threshold voltage nominal | +4.37/4.62V |
Maximum time at peak reflow temperature | NOT SPECIFIED |
CM1232PI | CM1232SI | CM1232P | CM1232S | CM1232FI | CM1232F | |
---|---|---|---|---|---|---|
Description | Power Supply Support Circuit, Fixed, 1 Channel, +4.37/4.62VV, CMOS, PDIP8, DIP-8 | Power Supply Support Circuit, Fixed, 1 Channel, +4.37/4.62VV, CMOS, PDSO16, SOIC-16 | Power Supply Support Circuit, Fixed, 1 Channel, +4.37/4.62VV, CMOS, PDIP8, PLASTIC, DIP-8 | Power Supply Support Circuit, Fixed, 1 Channel, +4.37/4.62VV, CMOS, PDSO16, SOIC-16 | Power Supply Support Circuit, Fixed, 1 Channel, CMOS, PDSO16, EIAJ, SOIC-16 | Power Supply Support Circuit, Fixed, 1 Channel, CMOS, PDSO16, EIAJ, SOIC-16 |
Maker | California Micro Devices | California Micro Devices | California Micro Devices | California Micro Devices | California Micro Devices | California Micro Devices |
Parts packaging code | DIP | SOIC | DIP | SOIC | SOIC | SOIC |
package instruction | DIP, DIP8,.3 | SOP, SOP16,.4 | DIP, DIP8,.3 | SOP, SOP16,.4 | SOP, | SOP, |
Contacts | 8 | 16 | 8 | 16 | 16 | 16 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Adjustable threshold | NO | NO | NO | NO | NO | NO |
Analog Integrated Circuits - Other Types | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 code | R-PDIP-T8 | R-PDSO-G16 | R-PDIP-T8 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
Number of channels | 1 | 1 | 1 | 1 | 1 | 1 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 8 | 16 | 8 | 16 | 16 | 16 |
Maximum operating temperature | 85 °C | 85 °C | 70 °C | 70 °C | 80 °C | 70 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | SOP | DIP | SOP | SOP | SOP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
surface mount | NO | YES | NO | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | OTHER | COMMERCIAL |
Terminal form | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | - | - |
JESD-609 code | e0 | e0 | e0 | e0 | - | - |
Encapsulate equivalent code | DIP8,.3 | SOP16,.4 | DIP8,.3 | SOP16,.4 | - | - |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
power supply | 5 V | 5 V | 5 V | 5 V | - | - |
Maximum supply current (Isup) | 2 mA | 2 mA | 2 mA | 2 mA | - | - |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | - | - |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - |
Threshold voltage nominal | +4.37/4.62V | +4.37/4.62V | +4.37/4.62V | +4.37/4.62V | - | - |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |