IS61NVP102418B-200B3 datasheet, PDF

IS61NVP102418B-200B3: DescriptionStandard SRAM, 1MX18, 3ns, CMOS, PBGA165, 13 X 15 MM, TFBGA-165; Categorystorage storage; File Size2MB，37 Pages; ManufacturerIntegrated Silicon Solution ( ISSI )

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IS61NVP102418B-200B3 Overview

Standard SRAM, 1MX18, 3ns, CMOS, PBGA165, 13 X 15 MM, TFBGA-165

Parameter Name	Attribute value
Maker	Integrated Silicon Solution ( ISSI )
package instruction	TBGA,
Reach Compliance Code	unknown
Maximum access time	3 ns
JESD-30 code	R-PBGA-B165
length	15 mm
memory density	18874368 bit
Memory IC Type	STANDARD SRAM
memory width	18
Number of functions	1
Number of terminals	165
word count	1048576 words
character code	1000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX18
Package body material	PLASTIC/EPOXY
encapsulated code	TBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE
Parallel/Serial	PARALLEL
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	2.625 V
Minimum supply voltage (Vsup)	2.375 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
width	13 mm

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