®
FLAT-PAC™ 3
Low Profile Inductors
Description
• 155C maximum total temperature operation
• Low profile high current inductors
• Inductance range 0.1uh to 15uh
• Design utilizes high temperature powder iron material
with a non-organic binder to eliminate thermal aging
• Current rating up to 34.7Adc (Higher peak currents may
be attained with a greater rolloff, see rolloff curve)
• Frequency range up to 2MHz
Applications
• Computers and portable power devices
• Energy storage applications
• DC-DC converters
• Input - Output filer application
Environmental Data
• Storage temperature range: -40C to +155C
• Operating ambient temperature range: -40C to +155C
(range is application specific).
• Infrared reflow temperature: +260C for 10 seconds
maximum
Part
Number
FP3-R10
FP3-R20
FP3-R47
FP3-R68
FP3-1R0
FP3-1R5
FP3-2R0
FP3-3R3
FP3-4R7
FP3-8R2
FP3-150
Rated
Inductance
µH
0.10
0.20
0.47
0.68
1.00
1.50
2.00
3.30
4.70
8.20
15.0
OCL (1)
µH ± 15%
0.10
0.22
0.44
0.72
1.10
1.50
2.00
3.20
4.70
8.5
14.9
Irms (2)
Amperes
19.0
15.3
10.9
9.72
6.26
5.78
5.40
3.63
3.23
2.91
2.22
Packaging
• Units supplied in tape and reel packaging.
Reel quantity = 1,700 parts per reel.
Isat (3)
Amperes
Approx. 10%
27
16
11.6
9.0
7.4
6.2
5.4
4.3
3.5
2.6
2.0
Isat (4)
Amperes
Approx. 15%
34.7
20.8
14.9
11.6
9.5
8.0
6.9
5.5
4.2
3.4
2.5
DCR
mOhms @ 20°C
(Max.)
1.21
1.88
3.67
4.63
11.2
13.1
15.0
30.0
40.0
74.0
127
K-factor (5)
803
482
344
268
219
185
161
127
105
78
59
1) OCL (Open Circuit Inductance) Test parameters: 100kHz, 0.1Vrms, 0.0Adc
2) DC current for an approximate
∆T
of 40°C without core loss. Derating is
necessary for AC currents. PCB layout, trace thickness and width, air-flow, and
proximity of other heat generating components will affect the temperature rise.
It is recommended that the temperature of the part not exceed 155°C under
worst case operating conditions verified in the end application.
3) Isat Amperes Peak for approximately 10% rolloff @ 20°C
4) Isat Amperes Peak for approximately 15% rolloff @ 20°C
5) K-factor: Used to determine B p-p for core loss (see graph). B p-p =K*L*∆I
B p-p:(Gauss), K: (K factor from table), L: (Inductance in uH),
∆I
(Peak to peak
ripple current in Amps).
Mechanical Diagrams
(2x)
TOP VIEW
2.8±0.25
SIDE VIEW
1.0 min.
(2x)
7.25
Max
RECOMMENDED PCB PAD LAYOUT
SCHEMATIC
FRONT VIEW
1
1
3.00 Max
FP3
XXX
yww
2
6.70
Max
7.50
2.50 (2x)
2.8±0.25
(2x)
2
4.50 (2x)
Packaging Information
1.5 Dia
min.
0.30
+/-0.05
0.3 Rad
max.
Bo
4.0
2.0
1.5 Dia
+0.1/-0.0
A
1.75
1
7.5
16.0
+/-0.3
2
Ko
Ao
12.0
A
0.5 Rad
typ.
Ao= 6.6mm
Bo= 7.1mm
Ko= 3.2mm
Dimensions in Millimeters
SECTION A-A
Direction of Feed
®
FLAT-PAC™ 3
Low Profile Inductors
PM-4118 7/05
© Cooper Electronic
Technologies 2005
Visit us on the Web at www.cooperET.com
3601 Quantum Boulevard Boynton Beach, Florida 33426-8638
Tel: +1-561-752-5000 Toll Free: +1-888-414-2645 Fax: +1-561-742-1178
This bulletin is intended to present product design solutions and technical information that will help the end user with design applications. Cooper Electronic
Technologies reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper
Electronic Technologies also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a product has been
selected, it should be tested by the user in all possible applications.
Life Support Policy: Cooper Electronic Technologies does not authorize the use of any of its products for use in life support devices or systems without the
express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when
properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
京公网安备 11010802033920号
EEWORLD
