IC,PROM,512X4,TTL,DIP,16PIN,CERAMIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Texas Instruments |
package instruction | DIP, DIP16,.3 |
Reach Compliance Code | unknown |
Maximum access time | 50 ns |
JESD-30 code | R-XDIP-T16 |
JESD-609 code | e0 |
memory density | 2048 bit |
Memory IC Type | OTP ROM |
memory width | 4 |
Number of terminals | 16 |
word count | 512 words |
character code | 512 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 512X4 |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP16,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Certification status | Not Qualified |
Filter level | 38535Q/M;38534H;883B |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | TTL |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |