Audio Amplifier, DIE
Parameter Name | Attribute value |
Maker | Gennum ( Semtech ) |
Parts packaging code | DIE |
package instruction | DIE, |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Commercial integrated circuit types | AUDIO AMPLIFIER |
JESD-30 code | R-XUUC-N |
Package body material | UNSPECIFIED |
encapsulated code | DIE |
Package shape | RECTANGULAR |
Package form | UNCASED CHIP |
Certification status | Not Qualified |
surface mount | YES |
Terminal form | NO LEAD |
Terminal location | UPPER |
LC522-CHIP | LC522-DIP | LC522-SOIC | |
---|---|---|---|
Description | Audio Amplifier, DIE | Audio Amplifier, PDIP14, DIP-14 | Audio Amplifier, PDSO14, SOIC-14 |
Maker | Gennum ( Semtech ) | Gennum ( Semtech ) | Gennum ( Semtech ) |
Parts packaging code | DIE | DIP | SOIC |
Reach Compliance Code | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 |
Commercial integrated circuit types | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER |
JESD-30 code | R-XUUC-N | R-PDIP-T14 | R-PDSO-G14 |
Package body material | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | UNCASED CHIP | IN-LINE | SMALL OUTLINE |
Certification status | Not Qualified | Not Qualified | Not Qualified |
surface mount | YES | NO | YES |
Terminal form | NO LEAD | THROUGH-HOLE | GULL WING |
Terminal location | UPPER | DUAL | DUAL |
Contacts | - | 14 | 14 |
Number of terminals | - | 14 | 14 |