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HYB25D256400CT-6

Description
DDR DRAM, 64MX4, 0.7ns, CMOS, PDSO66, PLASTIC, TSOP2-66
Categorystorage    storage   
File Size5MB,91 Pages
ManufacturerInfineon
Websitehttp://www.infineon.com/
Download Datasheet Parametric Compare View All

HYB25D256400CT-6 Overview

DDR DRAM, 64MX4, 0.7ns, CMOS, PDSO66, PLASTIC, TSOP2-66

HYB25D256400CT-6 Parametric

Parameter NameAttribute value
MakerInfineon
Parts packaging codeTSOP2
package instructionTSOP2,
Contacts66
Reach Compliance Codeunknown
ECCN codeEAR99
access modeFOUR BANK PAGE BURST
Maximum access time0.7 ns
Other featuresAUTO/SELF REFRESH
JESD-30 codeR-PDSO-G66
length22.22 mm
memory density268435456 bit
Memory IC TypeDDR DRAM
memory width4
Number of functions1
Number of ports1
Number of terminals66
word count67108864 words
character code64000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize64MX4
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP2
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Certification statusNot Qualified
Maximum seat height1.2 mm
self refreshYES
Maximum supply voltage (Vsup)2.7 V
Minimum supply voltage (Vsup)2.3 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
width10.16 mm

HYB25D256400CT-6 Related Products

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Description DDR DRAM, 64MX4, 0.7ns, CMOS, PDSO66, PLASTIC, TSOP2-66 DDR DRAM, 16MX16, 0.5ns, CMOS, PBGA60, 8 X 12 MM, GREEN, PLASTIC, TFBGA-60 DDR DRAM, 32MX8, 0.5ns, CMOS, PBGA60, 8 X 12 MM, GREEN, PLASTIC, TFBGA-60 DDR DRAM, 64MX4, 0.7ns, CMOS, PBGA60, 8 X 12 MM, GREEN, PLASTIC, TFBGA-60 DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, GREEN, PLASTIC, TSOP2-66 DDR DRAM, 64MX4, 0.5ns, CMOS, PBGA60, 8 X 12 MM, GREEN, PLASTIC, TFBGA-60 DDR DRAM, 16MX16, 0.7ns, CMOS, PBGA60, 8 X 12 MM, GREEN, PLASTIC, TFBGA-60 DDR DRAM, 64MX4, 0.5ns, CMOS, PDSO66, PLASTIC, TSOP2-66
Parts packaging code TSOP2 BGA BGA BGA TSOP2 BGA BGA TSOP2
package instruction TSOP2, TBGA, TBGA, TBGA, TSOP2, TBGA, TBGA, TSOP2,
Contacts 66 60 60 60 66 60 60 66
Reach Compliance Code unknown compliant compliant compliant compliant compliant compliant unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
access mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Maximum access time 0.7 ns 0.5 ns 0.5 ns 0.7 ns 0.7 ns 0.5 ns 0.7 ns 0.5 ns
Other features AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 code R-PDSO-G66 R-PBGA-B60 R-PBGA-B60 R-PBGA-B60 R-PDSO-G66 R-PBGA-B60 R-PBGA-B60 R-PDSO-G66
length 22.22 mm 12 mm 12 mm 12 mm 22.22 mm 12 mm 12 mm 22.22 mm
memory density 268435456 bit 268435456 bit 268435456 bit 268435456 bit 268435456 bit 268435456 bit 268435456 bit 268435456 bit
Memory IC Type DDR DRAM DDR DRAM DDR DRAM DDR DRAM DDR DRAM DDR DRAM DDR DRAM DDR DRAM
memory width 4 16 8 4 16 4 16 4
Number of functions 1 1 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1 1 1
Number of terminals 66 60 60 60 66 60 60 66
word count 67108864 words 16777216 words 33554432 words 67108864 words 16777216 words 67108864 words 16777216 words 67108864 words
character code 64000000 16000000 32000000 64000000 16000000 64000000 16000000 64000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 64MX4 16MX16 32MX8 64MX4 16MX16 64MX4 16MX16 64MX4
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP2 TBGA TBGA TBGA TSOP2 TBGA TBGA TSOP2
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE SMALL OUTLINE, THIN PROFILE GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm
self refresh YES YES YES YES YES YES YES YES
Maximum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Minimum supply voltage (Vsup) 2.3 V 2.5 V 2.5 V 2.3 V 2.3 V 2.5 V 2.3 V 2.5 V
Nominal supply voltage (Vsup) 2.5 V 2.6 V 2.6 V 2.5 V 2.5 V 2.6 V 2.5 V 2.6 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form GULL WING BALL BALL BALL GULL WING BALL BALL GULL WING
Terminal pitch 0.65 mm 1 mm 1 mm 1 mm 0.65 mm 1 mm 1 mm 0.65 mm
Terminal location DUAL BOTTOM BOTTOM BOTTOM DUAL BOTTOM BOTTOM DUAL
width 10.16 mm 8 mm 8 mm 8 mm 10.16 mm 8 mm 8 mm 10.16 mm
Maker Infineon Infineon - - Infineon Infineon Infineon Infineon
Is it Rohs certified? - conform to conform to conform to conform to conform to conform to -
JESD-609 code - e1 e1 e1 e3 e1 e1 -
Peak Reflow Temperature (Celsius) - 260 260 260 260 260 260 -
Terminal surface - Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Matte Tin (Sn) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) -
Maximum time at peak reflow temperature - 40 40 40 40 40 40 -

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