DDR DRAM, 64MX4, 0.7ns, CMOS, PDSO66, PLASTIC, TSOP2-66
Parameter Name | Attribute value |
Maker | Infineon |
Parts packaging code | TSOP2 |
package instruction | TSOP2, |
Contacts | 66 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
access mode | FOUR BANK PAGE BURST |
Maximum access time | 0.7 ns |
Other features | AUTO/SELF REFRESH |
JESD-30 code | R-PDSO-G66 |
length | 22.22 mm |
memory density | 268435456 bit |
Memory IC Type | DDR DRAM |
memory width | 4 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 66 |
word count | 67108864 words |
character code | 64000000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 64MX4 |
Package body material | PLASTIC/EPOXY |
encapsulated code | TSOP2 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE |
Certification status | Not Qualified |
Maximum seat height | 1.2 mm |
self refresh | YES |
Maximum supply voltage (Vsup) | 2.7 V |
Minimum supply voltage (Vsup) | 2.3 V |
Nominal supply voltage (Vsup) | 2.5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | GULL WING |
Terminal pitch | 0.65 mm |
Terminal location | DUAL |
width | 10.16 mm |
HYB25D256400CT-6 | HYB25D256160CF-5 | HYB25D256800CF-5 | HYB25D256400CF-6 | HYB25D256160CEL-6 | HYB25D256400CF-5 | HYB25D256160CF-6 | HYB25D256400CT-5 | |
---|---|---|---|---|---|---|---|---|
Description | DDR DRAM, 64MX4, 0.7ns, CMOS, PDSO66, PLASTIC, TSOP2-66 | DDR DRAM, 16MX16, 0.5ns, CMOS, PBGA60, 8 X 12 MM, GREEN, PLASTIC, TFBGA-60 | DDR DRAM, 32MX8, 0.5ns, CMOS, PBGA60, 8 X 12 MM, GREEN, PLASTIC, TFBGA-60 | DDR DRAM, 64MX4, 0.7ns, CMOS, PBGA60, 8 X 12 MM, GREEN, PLASTIC, TFBGA-60 | DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, GREEN, PLASTIC, TSOP2-66 | DDR DRAM, 64MX4, 0.5ns, CMOS, PBGA60, 8 X 12 MM, GREEN, PLASTIC, TFBGA-60 | DDR DRAM, 16MX16, 0.7ns, CMOS, PBGA60, 8 X 12 MM, GREEN, PLASTIC, TFBGA-60 | DDR DRAM, 64MX4, 0.5ns, CMOS, PDSO66, PLASTIC, TSOP2-66 |
Parts packaging code | TSOP2 | BGA | BGA | BGA | TSOP2 | BGA | BGA | TSOP2 |
package instruction | TSOP2, | TBGA, | TBGA, | TBGA, | TSOP2, | TBGA, | TBGA, | TSOP2, |
Contacts | 66 | 60 | 60 | 60 | 66 | 60 | 60 | 66 |
Reach Compliance Code | unknown | compliant | compliant | compliant | compliant | compliant | compliant | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
access mode | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
Maximum access time | 0.7 ns | 0.5 ns | 0.5 ns | 0.7 ns | 0.7 ns | 0.5 ns | 0.7 ns | 0.5 ns |
Other features | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
JESD-30 code | R-PDSO-G66 | R-PBGA-B60 | R-PBGA-B60 | R-PBGA-B60 | R-PDSO-G66 | R-PBGA-B60 | R-PBGA-B60 | R-PDSO-G66 |
length | 22.22 mm | 12 mm | 12 mm | 12 mm | 22.22 mm | 12 mm | 12 mm | 22.22 mm |
memory density | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit |
Memory IC Type | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM |
memory width | 4 | 16 | 8 | 4 | 16 | 4 | 16 | 4 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of ports | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 66 | 60 | 60 | 60 | 66 | 60 | 60 | 66 |
word count | 67108864 words | 16777216 words | 33554432 words | 67108864 words | 16777216 words | 67108864 words | 16777216 words | 67108864 words |
character code | 64000000 | 16000000 | 32000000 | 64000000 | 16000000 | 64000000 | 16000000 | 64000000 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 64MX4 | 16MX16 | 32MX8 | 64MX4 | 16MX16 | 64MX4 | 16MX16 | 64MX4 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | TSOP2 | TBGA | TBGA | TBGA | TSOP2 | TBGA | TBGA | TSOP2 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
self refresh | YES | YES | YES | YES | YES | YES | YES | YES |
Maximum supply voltage (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
Minimum supply voltage (Vsup) | 2.3 V | 2.5 V | 2.5 V | 2.3 V | 2.3 V | 2.5 V | 2.3 V | 2.5 V |
Nominal supply voltage (Vsup) | 2.5 V | 2.6 V | 2.6 V | 2.5 V | 2.5 V | 2.6 V | 2.5 V | 2.6 V |
surface mount | YES | YES | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | GULL WING | BALL | BALL | BALL | GULL WING | BALL | BALL | GULL WING |
Terminal pitch | 0.65 mm | 1 mm | 1 mm | 1 mm | 0.65 mm | 1 mm | 1 mm | 0.65 mm |
Terminal location | DUAL | BOTTOM | BOTTOM | BOTTOM | DUAL | BOTTOM | BOTTOM | DUAL |
width | 10.16 mm | 8 mm | 8 mm | 8 mm | 10.16 mm | 8 mm | 8 mm | 10.16 mm |
Maker | Infineon | Infineon | - | - | Infineon | Infineon | Infineon | Infineon |
Is it Rohs certified? | - | conform to | conform to | conform to | conform to | conform to | conform to | - |
JESD-609 code | - | e1 | e1 | e1 | e3 | e1 | e1 | - |
Peak Reflow Temperature (Celsius) | - | 260 | 260 | 260 | 260 | 260 | 260 | - |
Terminal surface | - | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Matte Tin (Sn) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | - |
Maximum time at peak reflow temperature | - | 40 | 40 | 40 | 40 | 40 | 40 | - |