Memory Circuit, 8MX16, CMOS, PBGA88, LEAD FREE, FBGA-88
Parameter Name | Attribute value |
Maker | Micron Technology |
Parts packaging code | BGA |
package instruction | LFBGA, |
Contacts | 88 |
Reach Compliance Code | unknown |
Other features | CELLULARRAM IS ORGANIZED AS 2M X 16; CONTAINS ADDITIONAL 8M X 16 FLASH |
JESD-30 code | R-PBGA-B88 |
JESD-609 code | e1 |
length | 12 mm |
memory density | 134217728 bit |
Memory IC Type | MEMORY CIRCUIT |
memory width | 16 |
Number of functions | 1 |
Number of terminals | 88 |
word count | 8388608 words |
character code | 8000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -25 °C |
organize | 8MX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | LFBGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, LOW PROFILE, FINE PITCH |
Certification status | Not Qualified |
Maximum seat height | 1.4 mm |
Maximum supply voltage (Vsup) | 1.95 V |
Minimum supply voltage (Vsup) | 1.7 V |
surface mount | YES |
technology | CMOS |
Temperature level | OTHER |
Terminal surface | TIN SILVER COPPER |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
width | 9 mm |