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MT54W2MH8JF-7.5

Description
QDR SRAM, 2MX8, 0.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165
Categorystorage    storage   
File Size414KB,28 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
Download Datasheet Parametric View All

MT54W2MH8JF-7.5 Overview

QDR SRAM, 2MX8, 0.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165

MT54W2MH8JF-7.5 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicron Technology
Parts packaging codeBGA
package instruction13 X 15 MM, 1 MM PITCH, FBGA-165
Contacts165
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Factory Lead Time1 week
Maximum access time0.5 ns
Other featuresPIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)133 MHz
I/O typeSEPARATE
JESD-30 codeR-PBGA-B165
JESD-609 codee0
length15 mm
memory density16777216 bit
Memory IC TypeQDR SRAM
memory width8
Number of functions1
Number of terminals165
word count2097152 words
character code2000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize2MX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTBGA
Encapsulate equivalent codeBGA165,11X15,40
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE
Parallel/SerialPARALLEL
power supply1.5/1.8,1.8 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum standby current0.125 A
Minimum standby current1.7 V
Maximum slew rate0.235 mA
Maximum supply voltage (Vsup)1.9 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
width13 mm

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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