HB54R1G9F2-B75B datasheet, PDF

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HB54R1G9F2-B75B: DescriptionDDR DRAM Module, 128MX4, CMOS, GOLD CONTACTS, DIMM-184; Categorystorage storage; File Size140KB，18 Pages; ManufacturerHitachi （Renesas ）; Websitehttp://www.renesas.com/eng/

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HB54R1G9F2-B75B Overview

DDR DRAM Module, 128MX4, CMOS, GOLD CONTACTS, DIMM-184

HB54R1G9F2-B75B Parametric

Parameter Name	Attribute value
Maker	Hitachi （Renesas ）
Parts packaging code	DIMM
package instruction	DIMM,
Contacts	184
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	DUAL BANK PAGE BURST
Other features	AUTO/SELF REFRESH; SEATED HGT-NOM
JESD-30 code	R-XDMA-N184
length	133.35 mm
memory density	536870912 bit
Memory IC Type	DDR DRAM MODULE
memory width	4
Number of functions	1
Number of ports	1
Number of terminals	184
word count	134217728 words
character code	128000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	55 °C
Minimum operating temperature
organize	128MX4
Package body material	UNSPECIFIED
encapsulated code	DIMM
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Certification status	Not Qualified
Maximum seat height	43.18 mm
self refresh	YES
Maximum supply voltage (Vsup)	2.7 V
Minimum supply voltage (Vsup)	2.3 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	DUAL
width	4.8 mm

HB54R1G9F2-B75B Related Products

	HB54R1G9F2-B75B	HB54R1G9F2-A75B	HB54R1G9F2-10B
Description	DDR DRAM Module, 128MX4, CMOS, GOLD CONTACTS, DIMM-184	DDR DRAM Module, 128MX4, CMOS, GOLD CONTACTS, DIMM-184	DDR DRAM Module, 128MX4, CMOS, GOLD CONTACTS, DIMM-184
Maker	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）
Parts packaging code	DIMM	DIMM	DIMM
package instruction	DIMM,	DIMM,	DIMM,
Contacts	184	184	184
Reach Compliance Code	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99
access mode	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST
Other features	AUTO/SELF REFRESH; SEATED HGT-NOM	AUTO/SELF REFRESH; SEATED HGT-NOM	AUTO/SELF REFRESH; SEATED HGT-NOM
JESD-30 code	R-XDMA-N184	R-XDMA-N184	R-XDMA-N184
length	133.35 mm	133.35 mm	133.35 mm
memory density	536870912 bit	536870912 bit	536870912 bit
Memory IC Type	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE
memory width	4	4	4
Number of functions	1	1	1
Number of ports	1	1	1
Number of terminals	184	184	184
word count	134217728 words	134217728 words	134217728 words
character code	128000000	128000000	128000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	55 °C	55 °C	55 °C
organize	128MX4	128MX4	128MX4
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIMM	DIMM	DIMM
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	43.18 mm	43.18 mm	43.18 mm
self refresh	YES	YES	YES
Maximum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V
Minimum supply voltage (Vsup)	2.3 V	2.3 V	2.3 V
Nominal supply voltage (Vsup)	2.5 V	2.5 V	2.5 V
surface mount	NO	NO	NO
technology	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL
width	4.8 mm	4.8 mm	4.8 mm

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