IDT7MB4040S25P datasheet, PDF - EEWORLD Datasheet

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IDT7MB4040S25P: DescriptionSRAM Module, 256KX9, 25ns, CMOS, PDIP44, 3.400 X 0.600 INCH, 0.350 INCH HEIGHT, PLASTIC, DIP-44; Categorystorage storage; File Size158KB，7 Pages; ManufacturerIDT (Integrated Device Technology)

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IDT7MB4040S25P Overview

SRAM Module, 256KX9, 25ns, CMOS, PDIP44, 3.400 X 0.600 INCH, 0.350 INCH HEIGHT, PLASTIC, DIP-44

IDT7MB4040S25P Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	IDT (Integrated Device Technology)
Parts packaging code	DIP
package instruction	3.400 X 0.600 INCH, 0.350 INCH HEIGHT, PLASTIC, DIP-44
Contacts	44
Reach Compliance Code	not_compliant
ECCN code	3A991.B.2.A
Maximum access time	25 ns
Other features	TTL COMPATIBLE INPUTS/OUTPUTS
I/O type	SEPARATE
JESD-30 code	R-PDIP-T44
JESD-609 code	e0
length	86.36 mm
memory density	2359296 bit
Memory IC Type	SRAM MODULE
memory width	9
Number of functions	1
Number of terminals	44
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX9
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP44,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	9.398 mm
Maximum standby current	0.27 A
Minimum standby current	4.5 V
Maximum slew rate	1.44 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm

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Description	SRAM Module, 256KX9, 25ns, CMOS, PDIP44, 3.400 X 0.600 INCH, 0.350 INCH HEIGHT, PLASTIC, DIP-44	SRAM Module, 256KX9, 20ns, CMOS, PDIP44, 3.400 X 0.600 INCH, 0.350 INCH HEIGHT, PLASTIC, DIP-44	SRAM Module, 256KX9, 15ns, CMOS, PDIP44, 3.400 X 0.600 INCH, 0.350 INCH HEIGHT, PLASTIC, DIP-44	SRAM Module, 256KX9, 12ns, CMOS, PDIP44, 3.400 X 0.600 INCH, 0.350 INCH HEIGHT, PLASTIC, DIP-44	SRAM Module, 256KX9, 10ns, CMOS, PDIP44, 3.400 X 0.600 INCH, 0.350 INCH HEIGHT, PLASTIC, DIP-44	SRAM Module, 256KX9, 17ns, CMOS, PDIP44, 3.400 X 0.600 INCH, 0.350 INCH HEIGHT, PLASTIC, DIP-44	SRAM Module, 256KX9, 35ns, CMOS, PDIP44, 3.400 X 0.600 INCH, 0.350 INCH HEIGHT, PLASTIC, DIP-44
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	DIP	DIP	DIP	DIP	DIP	DIP	DIP
package instruction	3.400 X 0.600 INCH, 0.350 INCH HEIGHT, PLASTIC, DIP-44	3.400 X 0.600 INCH, 0.350 INCH HEIGHT, PLASTIC, DIP-44	3.400 X 0.600 INCH, 0.350 INCH HEIGHT, PLASTIC, DIP-44	3.400 X 0.600 INCH, 0.350 INCH HEIGHT, PLASTIC, DIP-44	3.400 X 0.600 INCH, 0.350 INCH HEIGHT, PLASTIC, DIP-44	3.400 X 0.600 INCH, 0.350 INCH HEIGHT, PLASTIC, DIP-44	3.400 X 0.600 INCH, 0.350 INCH HEIGHT, PLASTIC, DIP-44
Contacts	44	44	44	44	44	44	44
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
ECCN code	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	25 ns	20 ns	15 ns	12 ns	10 ns	17 ns	35 ns
Other features	TTL COMPATIBLE INPUTS/OUTPUTS	TTL COMPATIBLE INPUTS/OUTPUTS	TTL COMPATIBLE INPUTS/OUTPUTS	TTL COMPATIBLE INPUTS/OUTPUTS	TTL COMPATIBLE INPUTS/OUTPUTS	TTL COMPATIBLE INPUTS/OUTPUTS	TTL COMPATIBLE INPUTS/OUTPUTS
I/O type	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE
JESD-30 code	R-PDIP-T44	R-PDIP-T44	R-PDIP-T44	R-PDIP-T44	R-PDIP-T44	R-PDIP-T44	R-PDIP-T44
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
length	86.36 mm	86.36 mm	86.36 mm	86.36 mm	86.36 mm	86.36 mm	86.36 mm
memory density	2359296 bit	2359296 bit	2359296 bit	2359296 bit	2359296 bit	2359296 bit	2359296 bit
Memory IC Type	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE
memory width	9	9	9	9	9	9	9
Number of functions	1	1	1	1	1	1	1
Number of terminals	44	44	44	44	44	44	44
word count	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words
character code	256000	256000	256000	256000	256000	256000	256000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	256KX9	256KX9	256KX9	256KX9	256KX9	256KX9	256KX9
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP44,.6	DIP44,.6	DIP44,.6	DIP44,.6	DIP44,.6	DIP44,.6	DIP44,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	9.398 mm	9.398 mm	9.398 mm	9.398 mm	9.398 mm	9.398 mm	9.398 mm
Maximum standby current	0.27 A	0.27 A	0.27 A	0.27 A	0.27 A	0.27 A	0.27 A
Minimum standby current	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Maximum slew rate	1.44 mA	1.44 mA	1.44 mA	1.44 mA	1.71 mA	1.44 mA	1.44 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm
Maker	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	-	-	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)

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