Synchronous DRAM Module, 2MX64, 9ns, CMOS, PDMA144
Parameter Name | Attribute value |
Maker | FUJITSU |
package instruction | , |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
access mode | DUAL BANK PAGE BURST |
Maximum access time | 9 ns |
Other features | AUTO/SELF REFRESH |
JESD-30 code | R-PDMA-N144 |
memory density | 134217728 bit |
Memory IC Type | SYNCHRONOUS DRAM MODULE |
memory width | 64 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 144 |
word count | 2097152 words |
character code | 2000000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 2MX64 |
Package body material | PLASTIC/EPOXY |
Package shape | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY |
Certification status | Not Qualified |
self refresh | YES |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | NO LEAD |
Terminal location | DUAL |
MB8502S064AD-67DG | MB8502S064AD-100DG | MB8502S064AD-84DG | |
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Description | Synchronous DRAM Module, 2MX64, 9ns, CMOS, PDMA144 | Synchronous DRAM Module, 2MX64, 8.5ns, CMOS, PDMA144 | Synchronous DRAM Module, 2MX64, 8.5ns, CMOS, PDMA144 |
Maker | FUJITSU | FUJITSU | FUJITSU |
Reach Compliance Code | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 |
access mode | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST |
Maximum access time | 9 ns | 8.5 ns | 8.5 ns |
Other features | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
JESD-30 code | R-PDMA-N144 | R-PDMA-N144 | R-PDMA-N144 |
memory density | 134217728 bit | 134217728 bit | 134217728 bit |
Memory IC Type | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE |
memory width | 64 | 64 | 64 |
Number of functions | 1 | 1 | 1 |
Number of ports | 1 | 1 | 1 |
Number of terminals | 144 | 144 | 144 |
word count | 2097152 words | 2097152 words | 2097152 words |
character code | 2000000 | 2000000 | 2000000 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C |
organize | 2MX64 | 2MX64 | 2MX64 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
Certification status | Not Qualified | Not Qualified | Not Qualified |
self refresh | YES | YES | YES |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V |
surface mount | NO | NO | NO |
technology | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | NO LEAD | NO LEAD | NO LEAD |
Terminal location | DUAL | DUAL | DUAL |