128KX8 STANDARD SRAM, 15ns, PDSO32, TSOP2-32
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Rochester Electronics |
Parts packaging code | TSOP2 |
package instruction | TSOP2, |
Contacts | 32 |
Reach Compliance Code | unknown |
Maximum access time | 15 ns |
JESD-30 code | R-PDSO-G32 |
JESD-609 code | e0 |
length | 20.95 mm |
memory density | 1048576 bit |
Memory IC Type | STANDARD SRAM |
memory width | 8 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of terminals | 32 |
word count | 131072 words |
character code | 128000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 128KX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | TSOP2 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 235 |
Certification status | COMMERCIAL |
Maximum seat height | 1.2 mm |
Maximum supply voltage (Vsup) | 3.63 V |
Minimum supply voltage (Vsup) | 2.97 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | TIN LEAD |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 10.16 mm |
CY7C1019CV33-15ZC | CY7C1019CV33-15ZI | CY7C1019CV33-8VC | CY7C1019CV33-12ZI | CY7C1019CV33-15VI | CY7C1019CV33-12BVI | |
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Description | 128KX8 STANDARD SRAM, 15ns, PDSO32, TSOP2-32 | 128KX8 STANDARD SRAM, 15ns, PDSO32, TSOP2-32 | 128KX8 STANDARD SRAM, 8ns, PDSO32, 0.400 INCH, PLASTIC, SOJ-32 | 128KX8 STANDARD SRAM, 12ns, PDSO32, TSOP2-32 | 128KX8 STANDARD SRAM, 15ns, PDSO32, 0.400 INCH, PLASTIC, SOJ-32 | 128KX8 STANDARD SRAM, 12ns, PBGA48, 6 X 8 MM, 1 MM HEIGHT, VFBGGA-48 |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
Parts packaging code | TSOP2 | TSOP2 | SOJ | TSOP2 | SOJ | BGA |
package instruction | TSOP2, | TSOP2, | 0.400 INCH, PLASTIC, SOJ-32 | TSOP2, | SOJ, | 6 X 8 MM, 1 MM HEIGHT, VFBGGA-48 |
Contacts | 32 | 32 | 32 | 32 | 32 | 48 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
Maximum access time | 15 ns | 15 ns | 8 ns | 12 ns | 15 ns | 12 ns |
JESD-30 code | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-J32 | R-PDSO-G32 | R-PDSO-J32 | R-PBGA-B48 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
length | 20.95 mm | 20.95 mm | 20.955 mm | 20.95 mm | 20.955 mm | 8 mm |
memory density | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
memory width | 8 | 8 | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 32 | 32 | 32 | 32 | 32 | 48 |
word count | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
character code | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 85 °C | 70 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | - | -40 °C | - | -40 °C | -40 °C | -40 °C |
organize | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | TSOP2 | TSOP2 | SOJ | TSOP2 | SOJ | VFBGA |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | 235 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Certification status | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Maximum seat height | 1.2 mm | 1.2 mm | 3.7592 mm | 1.2 mm | 3.7592 mm | 1 mm |
Maximum supply voltage (Vsup) | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V |
Minimum supply voltage (Vsup) | 2.97 V | 2.97 V | 2.97 V | 2.97 V | 2.97 V | 2.97 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
Terminal form | GULL WING | GULL WING | J BEND | GULL WING | J BEND | BALL |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.75 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 6 mm |