IC,LATCH,QUAD,1-BIT,CMOS,DIP,16PIN,PLASTIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | STMicroelectronics |
Reach Compliance Code | not_compliant |
JESD-30 code | R-PDIP-T16 |
JESD-609 code | e0 |
Load capacitance (CL) | 50 pF |
Logic integrated circuit type | R-S LATCH |
Number of digits | 1 |
Number of functions | 4 |
Number of terminals | 16 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP16,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 3/15 V |
Prop。Delay @ Nom-Sup | 300 ns |
Certification status | Not Qualified |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
HCF4044BE | HCF4044BM013TR | HCF4043BM | HCF4043BE | |
---|---|---|---|---|
Description | IC,LATCH,QUAD,1-BIT,CMOS,DIP,16PIN,PLASTIC | IC,LATCH,QUAD,1-BIT,CMOS,SOP,16PIN,PLASTIC | IC,LATCH,QUAD,1-BIT,CMOS,SOP,16PIN,PLASTIC | IC,LATCH,QUAD,1-BIT,CMOS,DIP,16PIN,PLASTIC |
Is it Rohs certified? | incompatible | conform to | incompatible | incompatible |
Maker | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
Reach Compliance Code | not_compliant | compliant | not_compliant | _compli |
JESD-30 code | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T16 |
JESD-609 code | e0 | e4 | e0 | e0 |
Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF |
Logic integrated circuit type | R-S LATCH | R-S LATCH | R-S LATCH | R-S LATCH |
Number of digits | 1 | 1 | 1 | 1 |
Number of functions | 4 | 4 | 4 | 4 |
Number of terminals | 16 | 16 | 16 | 16 |
Maximum operating temperature | 85 °C | 125 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -55 °C | -40 °C | -40 °C |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | SOP | SOP | DIP |
Encapsulate equivalent code | DIP16,.3 | SOP16,.25 | SOP16,.25 | DIP16,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
power supply | 3/15 V | 5/15 V | 3/15 V | 3/15 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
surface mount | NO | YES | YES | NO |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL |
Prop。Delay @ Nom-Sup | 300 ns | 300 ns | 300 ns | - |