MASK ROM, 512KX8, 200ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Hitachi （Renesas ） |
| Parts packaging code | DIP |
| package instruction | DIP, DIP32,.6 |
| Contacts | 32 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 200 ns |
| JESD-30 code | R-PDIP-T32 |
| JESD-609 code | e0 |
| length | 41.9 mm |
| memory density | 4194304 bit |
| Memory IC Type | MASK ROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 32 |
| word count | 524288 words |
| character code | 512000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 512KX8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP32,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| Maximum standby current | 0.00003 A |
| Maximum slew rate | 0.05 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 15.24 mm |
| HN62304BP | HN62304BF | HN62324BF | HN62324BP | |
|---|---|---|---|---|
| Description | MASK ROM, 512KX8, 200ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | MASK ROM, 512KX8, 200ns, CMOS, PDSO32, PLASTIC, SOP-32 | MASK ROM, 512KX8, 150ns, CMOS, PDSO32, PLASTIC, SOP-32 | MASK ROM, 512KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） |
| Parts packaging code | DIP | SOIC | SOIC | DIP |
| package instruction | DIP, DIP32,.6 | SOP, SOJ32,.44 | SOP, SOJ32,.44 | DIP, DIP32,.6 |
| Contacts | 32 | 32 | 32 | 32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 200 ns | 200 ns | 150 ns | 150 ns |
| JESD-30 code | R-PDIP-T32 | R-PDSO-G32 | R-PDSO-G32 | R-PDIP-T32 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| length | 41.9 mm | 20.45 mm | 20.45 mm | 41.9 mm |
| memory density | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
| Memory IC Type | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
| memory width | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 32 | 32 | 32 | 32 |
| word count | 524288 words | 524288 words | 524288 words | 524288 words |
| character code | 512000 | 512000 | 512000 | 512000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 512KX8 | 512KX8 | 512KX8 | 512KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | SOP | SOP | DIP |
| Encapsulate equivalent code | DIP32,.6 | SOJ32,.44 | SOJ32,.44 | DIP32,.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.08 mm | 3.05 mm | 3.05 mm | 5.08 mm |
| Maximum standby current | 0.00003 A | 0.00003 A | 0.00003 A | 0.00003 A |
| Maximum slew rate | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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