Jumbo-LED
07.05.2008
Radiation
Infrared
5,08
ELJ-830-649-1
rev. 02
Case
Plastic lens, metal case
Type
4W
Technology
AlGaAs/AlGaAs
Description
High-power infrared-LED in black anodised aluminium
case, with thread socket for easy handling and heat sink
mounting
1,5
Ø12,5
Ø16
Ø11
Ø1,7
1
2
4,5
Outline:
H = 12.4 mm (± 0.5)
2
Applications
Medical appliances, remote control and optical
communications, light barriers, measurement systems,
image recognition systems
7,9
D = 16 mm (± 0.5)
Thread M10
1
2
13
8
Pin 1 – cathode
Pin 2 – anode
M10
Absolute Maximum Ratings
at T
amb
= 25° on heat sink (S
≥
200 cm²), unless otherwise specified
C,
Parameter
DC forward current
Peak forward current
Power dissipation
Operating temperature range
Storage temperature range
Junction temperature
Test
сonditions
on heat sink
t
p
≤10
µs, D = 0,05
on heat sink
on heat sink
on heat sink
on heat sink
Symbol
I
F
I
FM
P
T
amb
T
stg
T
j
Value
1.2
2.0
2.8
-25 to +100
-25 to +100
100
Unit
A
A
W
°
C
°
C
°
C
Electrical Characteristics
T
amb
= 25° unless otherwise specified
C,
Parameter
Forward voltage
Forward voltage*
Switching time
Reverse voltage
Thermal resistance
junction-case
*only recommended on optimal heat sink
We reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each application by the customers themselves.
EPIGAP
Optoelektronik GmbH, D-12555 Berlin, Köpenicker Str.325 b, Haus 201
1 of 5
Tel.: +49-30-6576 2543, Fax : +49-30-6576 2545
Test
conditions
I
F
= 350 mA
I
F
= 1000 mA
I
F
= 350 mA
I
R
= 10 µA
Symbol
V
F
V
F
t
r
, t
f
V
R
R
thJC
Min
Typ
1.6
2.0
20
Max
1.9
2.4
Unit
V
V
ns
5
10
K/W
Jumbo-LED
07.05.2008
ELJ-830-649-1
rev. 02
Optical Characteristics
at T
amb
= 25° on heat sink (S
≥
200 cm²), unless otherwise specified
C,
Test
Parameter
Symbol
Min
conditions
Radiant power
Radiant power*
Radiant intensity
Radiant intensity*
Peak wavelength
Spectral bandwidth at 50%
Full viewing angle
I
F
= 350 mA
I
F
= 1000 mA
I
F
= 350 mA
I
F
= 1000 mA
I
F
= 350 mA
I
F
= 350 mA
I
F
= 350 mA
Φ
e
Φ
e
Ι
e
Ι
e
λ
p
∆λ
0.5
ϕ
820
200
80
Typ
110
300
300
850
830
35
35
840
Max
Unit
mW
mW
mW/sr
mW/sr
nm
nm
deg
*only recommended on optimal heat sink
Note: All measurements carried out with
EPIGAP
equipment, on blank aluminium heat sink, S = 180 cm², passive
cooling. Measurement results and curve characteristics obtained with other heat sinks may differ.
We reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each application by the customers themselves.
EPIGAP
Optoelektronik GmbH, D-12555 Berlin, Köpenicker Str.325 b, Haus 201
2 of 5
Tel.: +49-30-6576 2543, Fax : +49-30-6576 2545
Jumbo-LED
07.05.2008
Radiant Power vs. ForwardCurrent (typical)
Norm
alizedto
Φ
E
@I
F
= 350 m
A
1200
3,0
ELJ-830-649-1
rev. 02
Forw C
ard urrent vs. Forw Voltage (typical)
ard
3,5
Rel. Radiant Power
Φ
e
(rel.)
1000
2,5
800
I
F
(mA)
2,0
1,5
600
1,0
400
0,5
200
0,0
0
200
400
600
800
1000
1200
0
1,0
1,2
1,4
1,6
1,8
2,0
2,2
I
F
(mA)
U
F
(V)
Spectral Power Distribution (typical)
A
at I
F
= 350 m
1,0
9
8
7
Typical W
avelength Shift vs. ForwardCurrent
A
(rel. to
λ
P
@I
F
= 350 m )
Rel. Intensity (arb. units)
0,8
6
Wavelength Shift (nm)
750
800
850
900
950
1000
5
4
3
2
1
0
-1
-2
0,6
0,4
0,2
0,0
700
0
200
400
600
800
1000
1200
Wavelength (nm)
I
F
(mA)
A bient Tem
m
perature vs. M al Forward Current
axim
1,2
Max. Forward Current (A)
1,0
0,8
0,6
0,4
0,2
0,0
0
20
40
60
80
100
120
Ambient Temperature (° )
C
We reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each application by the customers themselves.
EPIGAP
Optoelektronik GmbH, D-12555 Berlin, Köpenicker Str.325 b, Haus 201
3 of 5
Tel.: +49-30-6576 2543, Fax : +49-30-6576 2545
Jumbo-LED
07.05.2008
ELJ-830-649-1
rev. 02
Remarks concerning optical radiation safety*
This LED may be classified as LED product Class 1 according to standard IEC 60825-1:A2 at low
forward current (<160 mA) and continuous operation.
Class 1
products are safe to eyes and skin
under reasonable predictable conditions. This implicates a direct observation of the light beam by
means of optical instruments.
This product should be classified as LED product Class 1M according to standard IEC 60825-1:A2 if
driven with higher continuous forward current (up to 1 A). Class 1M products are safe to eyes and
skin under normal conditions, even when users look into the light beam directly. Class 1M products
produce either a highly divergent beam or a large diameter beam, so only a small part of the whole
radiation beam can enter the eye. However, such optical products can be harmful to the retina using
magnifying optical instruments. Therefore, users should not incorporate optics that could focus the
output into the eyes.
*Note: Safety classification of an optical component mainly depends on the intended application and
the way the component is being used. Furthermore, all statements made to classification are based
on calculations and are only valid for this LED "as it is", and at continuous operation. Using pulsed
current or altering the light beam with additional optics may lead to different safety classifications.
Therefore these remarks should be taken as recommendation and guideline only.
INFRARED RADIATION
Do not view directly
with optical instruments
LED Class 1M
accord. DIN EN/IEC 60825-1:2001-11
We reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each application by the customers themselves.
EPIGAP
Optoelektronik GmbH, D-12555 Berlin, Köpenicker Str.325 b, Haus 201
4 of 5
Tel.: +49-30-6576 2543, Fax : +49-30-6576 2545
Jumbo-LED
07.05.2008
ELJ-830-649-1
rev. 02
Handling precautions
To prevent damage to the LED during soldering and assembly, following precautions have to be
taken into account.
a) The bending point of the lead frame
should be located at least 2.5 mm away
from the body.
b) While bending, the base of the lead
frame has to be fixed with radio pliers or
similar.
c) To ensure an adequate strain relief, the
lead frames have to be firmly fixed during
soldering.
d) To avoid any damage of the LED
during soldering the lead frames should
not be distorted especially when they
have been heated
e) LEDs are static sensitive devices, so
adequate handling precautions have to be
taken, e.g. wearing grounding wrist straps.
We reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each application by the customers themselves.
EPIGAP
Optoelektronik GmbH, D-12555 Berlin, Köpenicker Str.325 b, Haus 201
5 of 5
Tel.: +49-30-6576 2543, Fax : +49-30-6576 2545
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