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GS880F32GT-11.5T

Description
Cache SRAM, 256KX32, 11ns, CMOS, PQFP100, TQFP-100
Categorystorage    storage   
File Size350KB,25 Pages
ManufacturerGSI Technology
Websitehttp://www.gsitechnology.com/
Environmental Compliance  
Download Datasheet Parametric View All

GS880F32GT-11.5T Overview

Cache SRAM, 256KX32, 11ns, CMOS, PQFP100, TQFP-100

GS880F32GT-11.5T Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerGSI Technology
Parts packaging codeQFP
package instructionLQFP,
Contacts100
Reach Compliance Codecompliant
ECCN code3A991.B.2.B
Maximum access time11 ns
Other featuresFLOW-THROUGH ARCHITECTURE
JESD-30 codeR-PQFP-G100
JESD-609 codee3
length20 mm
memory density8388608 bit
Memory IC TypeCACHE SRAM
memory width32
Humidity sensitivity level3
Number of functions1
Number of terminals100
word count262144 words
character code256000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX32
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Package shapeRECTANGULAR
Package formFLATPACK, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfacePURE MATTE TIN
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width14 mm
Preliminary
GS880F18/36T-10/11/11.5/12/14
100 Pin TQFP
Commercial Temp
Industrial Temp
Features
• Flow through mode operation.
• 3.3V +10%/-5% Core power supply.
• 2.5V or 3.3V I/O supply.
• LBO pin for linear or interleaved burst mode.
• Internal input resistors on mode pins allow floating mode pins.
Default to Interleaved Pipelined Mode.
• Byte write (BW) and/or global write (GW) operation.
• Common data inputs and data outputs.
• Clock Control, registered, address, data, and control.
• Internal Self-Timed Write cycle.
• Automatic power-down for portable applications.
• 100-lead TQFP package
-10
-11
-11.5
-12
-14
10ns 11ns 11.5ns 12ns 14ns
Flow Through t
KQ
2-1-1-1
tCycle 10ns 15ns 15ns 15ns 15ns
I
DD
225mA 180mA 180mA 180mA 175mA
512K x 18, 256K x 36
8Mb Sync Burst SRAMs
10ns - 14ns
3.3V VDD
3.3V & 2.5V I/O
broadest access to multiple vendor sources. Boards designed with FT
pin pads tied low may be stuffed with GSI’s Pipeline/Flow through
configurable Burst RAMS or any vendor’s Flow through or
configurable Burst SRAM. Bumps designed with the FT pin location
tied High or floating must employ a non-configurable Flow through
Burst RAM, like this RAM, to achieve Flow through functionality.
88018/32/36T
Byte Write and Global Write
Byte write operation is performed by using byte write enable (BW)
input combined with one or more individual byte write signals (Bx). In
addition, Global Write (GW) is available for writing all bytes at one
time, regardless of the Byte Write control inputs.
Sleep Mode
Low power (Sleep mode) is attained through the assertion (High) of
the ZZ signal, or by stopping the clock (CK). Memory data is retained
during Sleep mode.
Core and Interface Voltages
The GS880F18/32/36T operates on a 3.3V power supply and all
inputs/outputs are 3.3V and 2.5V compatible. Separate output power
(V
DDQ
) pins are used to de-couple output noise from the internal
circuit.
Functional Description
Applications
The GS880F18/32/36T is a 9,437,184 bit (8,388,608 bit for x32
version) high performance synchronous SRAM with a 2 bit burst
address counter. Although of a type originally developed for Level 2
Cache applications supporting high performance CPU’s, the device
now finds application in synchronous SRAM applications ranging from
DSP main store to networking chip set support.
Controls
Addresses, data I/O’s, chip enables (E1, E2, E3), address burst
control inputs (ADSP, ADSC, ADV) and write control inputs (Bx, BW,
GW) are synchronous and are controlled by a positive edge triggered
clock input (CK). Output enable (G) and power down control (ZZ) are
asynchronous inputs. Burst cycles can be initiated with either ADSP
or ADSC inputs. In Burst mode, subsequent burst addresses are
generated internally and are controlled by ADV. The burst address
counter may be configured to count in either linear or interleave order
with the Linear Burst Order (LBO) input. The Burst function need not
be used. New addresses can be loaded on every cycle with no
degradation of chip performance.
Designing For Compatibility
The JEDEC Standard for Burst RAMS calls for a FT mode pin option
(pin 14 on TQFP). Board sites for Flow through Burst RAMS should
be designed with V
SS
connected to the FT pin location to ensure the
Rev: 1.03 3/2000
1/25
© 2000, Giga Semiconductor, Inc.
N
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

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