IC,DISK CONTROLLER,CMOS,DIP,40PIN
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Microchip |
package instruction | DIP, DIP40,.6 |
Reach Compliance Code | unknown |
JESD-30 code | R-PDIP-T40 |
Number of terminals | 40 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | -10 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP40,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Certification status | Not Qualified |
Maximum slew rate | 12 mA |
Nominal supply voltage | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
FDC72C66P | FDC72C66 | |
---|---|---|
Description | IC,DISK CONTROLLER,CMOS,DIP,40PIN | IC,DISK CONTROLLER,CMOS,DIP,40PIN |
Is it Rohs certified? | incompatible | incompatible |
Maker | Microchip | Microchip |
package instruction | DIP, DIP40,.6 | DIP, DIP40,.6 |
Reach Compliance Code | unknown | unknown |
JESD-30 code | R-PDIP-T40 | R-XDIP-T40 |
Number of terminals | 40 | 40 |
Maximum operating temperature | 70 °C | 70 °C |
Minimum operating temperature | -10 °C | -10 °C |
Package body material | PLASTIC/EPOXY | CERAMIC |
encapsulated code | DIP | DIP |
Encapsulate equivalent code | DIP40,.6 | DIP40,.6 |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE |
power supply | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified |
Maximum slew rate | 12 mA | 12 mA |
Nominal supply voltage | 5 V | 5 V |
surface mount | NO | NO |
technology | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL |
Terminal form | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL |