|
MBM29LV002T-12PTR-X |
MBM29LV002B-12PTR-X |
MBM29LV002T-12PNS-X |
MBM29LV002B-12PTN-X |
MBM29LV002B-12PNS-X |
MBM29LV002T-12PTN-X |
Description |
Flash, 256KX8, 120ns, PDSO40, PLASTIC, REVERSE, TSOP1-40 |
Flash, 256KX8, 120ns, PDSO40, PLASTIC, REVERSE, TSOP1-40 |
Flash, 256KX8, 120ns, PDSO40, PLASTIC, SON-40 |
Flash, 256KX8, 120ns, PDSO40, PLASTIC, TSOP1-40 |
Flash, 256KX8, 120ns, PDSO40, PLASTIC, SON-40 |
Flash, 256KX8, 120ns, PDSO40, PLASTIC, TSOP1-40 |
Maker |
FUJITSU |
FUJITSU |
FUJITSU |
FUJITSU |
FUJITSU |
FUJITSU |
package instruction |
TSOP1-R, |
PLASTIC, REVERSE, TSOP1-40 |
VSON, |
PLASTIC, TSOP1-40 |
PLASTIC, SON-40 |
TSOP1, |
Reach Compliance Code |
compliant |
unknown |
compliant |
unknown |
unknown |
compliant |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
Maximum access time |
120 ns |
120 ns |
120 ns |
120 ns |
120 ns |
120 ns |
Other features |
SECTOR ERASE; 100000 PROGRAM/ERASE CYCLES; TOP BOOT |
SECTOR ERASE; 100000 PROGRAM/ERASE CYCLES; BOTTOM BOOT |
SECTOR ERASE; 100000 PROGRAM/ERASE CYCLES; TOP BOOT |
SECTOR ERASE; 100000 PROGRAM/ERASE CYCLES; BOTTOM BOOT |
SECTOR ERASE; 100000 PROGRAM/ERASE CYCLES; BOTTOM BOOT |
SECTOR ERASE; 100000 PROGRAM/ERASE CYCLES; TOP BOOT |
startup block |
TOP |
BOTTOM |
TOP |
BOTTOM |
BOTTOM |
TOP |
JESD-30 code |
R-PDSO-G40 |
R-PDSO-G40 |
R-PDSO-N40 |
R-PDSO-G40 |
R-PDSO-N40 |
R-PDSO-G40 |
length |
18.4 mm |
18.4 mm |
10.75 mm |
18.4 mm |
10.75 mm |
18.4 mm |
memory density |
2097152 bit |
2097152 bit |
2097152 bit |
2097152 bit |
2097152 bit |
2097152 bit |
Memory IC Type |
FLASH |
FLASH |
FLASH |
FLASH |
FLASH |
FLASH |
memory width |
8 |
8 |
8 |
8 |
8 |
8 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
40 |
40 |
40 |
40 |
40 |
40 |
word count |
262144 words |
262144 words |
262144 words |
262144 words |
262144 words |
262144 words |
character code |
256000 |
256000 |
256000 |
256000 |
256000 |
256000 |
Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
organize |
256KX8 |
256KX8 |
256KX8 |
256KX8 |
256KX8 |
256KX8 |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
TSOP1-R |
TSOP1-R |
VSON |
TSOP1 |
VSON |
TSOP1 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE, THIN PROFILE |
SMALL OUTLINE, THIN PROFILE |
SMALL OUTLINE, VERY THIN PROFILE |
SMALL OUTLINE, THIN PROFILE |
SMALL OUTLINE, VERY THIN PROFILE |
SMALL OUTLINE, THIN PROFILE |
Parallel/Serial |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
Programming voltage |
3 V |
3 V |
3 V |
3 V |
3 V |
3 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
1.2 mm |
1.2 mm |
0.75 mm |
1.2 mm |
0.75 mm |
1.2 mm |
Maximum supply voltage (Vsup) |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
Minimum supply voltage (Vsup) |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
Nominal supply voltage (Vsup) |
3 V |
3 V |
3 V |
3 V |
3 V |
3 V |
surface mount |
YES |
YES |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal form |
GULL WING |
GULL WING |
NO LEAD |
GULL WING |
NO LEAD |
GULL WING |
Terminal pitch |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
width |
10 mm |
10 mm |
10 mm |
10 mm |
10 mm |
10 mm |