K6F4008U2G-EF700 datasheet, PDF

K6F4008U2G-EF700: DescriptionStandard SRAM, 512KX8, 70ns, CMOS, PBGA36, 6 X 7 MM, 0.75 MM PITCH, TBGA-48/36; Categorystorage storage; File Size156KB，9 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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K6F4008U2G-EF700 Overview

Standard SRAM, 512KX8, 70ns, CMOS, PBGA36, 6 X 7 MM, 0.75 MM PITCH, TBGA-48/36

Parameter Name	Attribute value
Maker	SAMSUNG
Parts packaging code	BGA
package instruction	VFBGA,
Contacts	36
Reach Compliance Code	unknown
ECCN code	3A991.B.2.A
Maximum access time	70 ns
JESD-30 code	R-PBGA-B36
length	7 mm
memory density	4194304 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of terminals	36
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512KX8
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	1 mm
Maximum supply voltage (Vsup)	3.3 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.75 mm
Terminal location	BOTTOM
width	6 mm

K6F4008U2G Family

Document Title

Preliminary

CMOS SRAM

512K x8 bit Super Low Power and Low Voltage Full CMOS Static RAM

Revision History

Revision No. History

0.0

Initial Draft

Draft Date

June 11, 2003

Remark

Preliminary

The attached datasheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications and

products. SAMSUNG Electronics will answer to your questions about device. If you have any questions, please contact the SAMSUNG branch offices.

-1-

Revision 0.0

June 2003

	K6F4008U2G-EF700	K6F4008U2G-EF550
Description	Standard SRAM, 512KX8, 70ns, CMOS, PBGA36, 6 X 7 MM, 0.75 MM PITCH, TBGA-48/36	Standard SRAM, 512KX8, 55ns, CMOS, PBGA36, 6 X 7 MM, 0.75 MM PITCH, TBGA-48/36
Maker	SAMSUNG	SAMSUNG
Parts packaging code	BGA	BGA
package instruction	VFBGA,	VFBGA,
Contacts	36	36
Reach Compliance Code	unknown	unknown
ECCN code	3A991.B.2.A	3A991.B.2.A
Maximum access time	70 ns	55 ns
JESD-30 code	R-PBGA-B36	R-PBGA-B36
length	7 mm	7 mm
memory density	4194304 bit	4194304 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM
memory width	8	8
Number of functions	1	1
Number of terminals	36	36
word count	524288 words	524288 words
character code	512000	512000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
organize	512KX8	512KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	VFBGA	VFBGA
Package shape	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified
Maximum seat height	1 mm	1 mm
Maximum supply voltage (Vsup)	3.3 V	3.3 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	3 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	BALL
Terminal pitch	0.75 mm	0.75 mm
Terminal location	BOTTOM	BOTTOM
width	6 mm	6 mm

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