OTP ROM, 1KX4, Bipolar, CQCC28, CERAMIC, LCC-28
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | AMD |
| Parts packaging code | QLCC |
| package instruction | QCCN, LCC28,.45SQ |
| Contacts | 28 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| JESD-30 code | S-CQCC-N28 |
| JESD-609 code | e0 |
| length | 11.43 mm |
| memory density | 4096 bit |
| Memory IC Type | OTP ROM |
| memory width | 4 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 1024 words |
| character code | 1000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 1KX4 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | QCCN |
| Encapsulate equivalent code | LCC28,.45SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Maximum seat height | 2.54 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | BIPOLAR |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 11.43 mm |
| AM27S65A/B3C | PTN2512K1290DSWP | PTN2512K2104DBT0 | AM27S65PCB | AM27S65/B3C | AM27S65/BKA | AM27S65/BLA | AM27S65A/BKA | AM27S65A/BLA | |
|---|---|---|---|---|---|---|---|---|---|
| Description | OTP ROM, 1KX4, Bipolar, CQCC28, CERAMIC, LCC-28 | Fixed Resistor, Thin Film, 2W, 129ohm, 200V, 0.5% +/-Tol, 100ppm/Cel, Surface Mount, 2512, CHIP | RESISTOR, THIN FILM, 1 W, 0.5 %, 100 ppm, 2100000 ohm, SURFACE MOUNT, 2512, CHIP | OTP ROM, 1KX4, Bipolar, PDIP24, 0.300 INCH, SLIM, PLASTIC, DIP-24 | OTP ROM, 1KX4, Bipolar, CQCC28, CERAMIC, LCC-28 | OTP ROM, 1KX4, Bipolar, CDFP24, CERAMIC, FP-24 | OTP ROM, 1KX4, Bipolar, CDIP24, 0.300 INCH, SLIM, HERMETIC SEALED, CERAMIC, DIP-24 | OTP ROM, 1KX4, Bipolar, CDFP24, CERAMIC, FP-24 | OTP ROM, 1KX4, Bipolar, CDIP24, 0.300 INCH, SLIM, HERMETIC SEALED, CERAMIC, DIP-24 |
| Is it Rohs certified? | incompatible | conform to | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | QCCN, LCC28,.45SQ | CHIP | SMT, 2512 | DIP, DIP24,.3 | QCCN, LCC28,.45SQ | DFP, FL24,.4 | DIP, DIP24,.3 | DFP, FL24,.4 | DIP, DIP24,.3 |
| Reach Compliance Code | unknown | compliant | compliant | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| JESD-609 code | e0 | e3 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 28 | 2 | 2 | 24 | 28 | 24 | 24 | 24 | 24 |
| Maximum operating temperature | 125 °C | 155 °C | 155 °C | 75 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | - | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Package form | CHIP CARRIER | SMT | SMT | IN-LINE | CHIP CARRIER | FLATPACK | IN-LINE | FLATPACK | IN-LINE |
| surface mount | YES | YES | YES | NO | YES | YES | NO | YES | NO |
| technology | BIPOLAR | THIN FILM | THIN FILM | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Terminal surface | Tin/Lead (Sn/Pb) | Matte Tin (Sn) - with Nickel (Ni) barrier | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Is it lead-free? | Contains lead | - | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Maker | AMD | - | - | AMD | AMD | AMD | AMD | AMD | AMD |
| Parts packaging code | QLCC | - | - | DIP | QLCC | DFP | DIP | DFP | DIP |
| Contacts | 28 | - | - | 24 | 28 | 24 | 24 | 24 | 24 |
| JESD-30 code | S-CQCC-N28 | - | - | R-PDIP-T24 | S-CQCC-N28 | R-CDFP-F24 | R-GDIP-T24 | R-CDFP-F24 | R-GDIP-T24 |
| length | 11.43 mm | - | - | 32.004 mm | 11.43 mm | 15.367 mm | 31.9405 mm | 15.367 mm | 31.9405 mm |
| memory density | 4096 bit | - | - | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit |
| Memory IC Type | OTP ROM | - | - | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| memory width | 4 | - | - | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of functions | 1 | - | - | 1 | 1 | 1 | 1 | 1 | 1 |
| word count | 1024 words | - | - | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words |
| character code | 1000 | - | - | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 |
| Operating mode | SYNCHRONOUS | - | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| organize | 1KX4 | - | - | 1KX4 | 1KX4 | 1KX4 | 1KX4 | 1KX4 | 1KX4 |
| Output characteristics | 3-STATE | - | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC, METAL-SEALED COFIRED | - | - | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| encapsulated code | QCCN | - | - | DIP | QCCN | DFP | DIP | DFP | DIP |
| Encapsulate equivalent code | LCC28,.45SQ | - | - | DIP24,.3 | LCC28,.45SQ | FL24,.4 | DIP24,.3 | FL24,.4 | DIP24,.3 |
| Package shape | SQUARE | - | - | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Parallel/Serial | PARALLEL | - | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Certification status | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Filter level | 38535Q/M;38534H;883B | - | - | - | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| Maximum seat height | 2.54 mm | - | - | 5.715 mm | 2.54 mm | 2.286 mm | 5.08 mm | 2.286 mm | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.5 V | - | - | 5.25 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | - | - | 4.75 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | - | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Temperature level | MILITARY | - | - | COMMERCIAL EXTENDED | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | NO LEAD | - | - | THROUGH-HOLE | NO LEAD | FLAT | THROUGH-HOLE | FLAT | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | - | - | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| Terminal location | QUAD | - | - | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 11.43 mm | - | - | 7.62 mm | 11.43 mm | 9.525 mm | 7.62 mm | 9.525 mm | 7.62 mm |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD