MV1471/CG/DPAS datasheet, PDF - EEWORLD Datasheet

MV1471/CG/DPAS: DescriptionDATACOM, HDB3 ENCODER/DECODER, PDIP16, PLASTIC, DIL-16; CategoryWireless rf/communication Telecom circuit; File Size585KB，9 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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MV1471/CG/DPAS Overview

DATACOM, HDB3 ENCODER/DECODER, PDIP16, PLASTIC, DIL-16

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Microsemi
Parts packaging code	DIP
package instruction	DIP, DIP16,.3
Contacts	16
Reach Compliance Code	unknown
JESD-30 code	R-PDIP-T16
JESD-609 code	e0
Number of functions	1
Number of terminals	16
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5.08 mm
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Telecom integrated circuit types	HDB3 ENCODER/DECODER
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm

	MV1471/CG/DPAS	MV1471/CG/DGAS
Description	DATACOM, HDB3 ENCODER/DECODER, PDIP16, PLASTIC, DIL-16	DATACOM, HDB3 ENCODER/DECODER, CDIP16, CERAMIC, DIL-16
Is it Rohs certified?	incompatible	incompatible
Maker	Microsemi	Microsemi
Parts packaging code	DIP	DIP
package instruction	DIP, DIP16,.3	DIP, DIP16,.3
Contacts	16	16
Reach Compliance Code	unknown	unknown
JESD-30 code	R-PDIP-T16	R-GDIP-T16
JESD-609 code	e0	e0
Number of functions	1	1
Number of terminals	16	16
Maximum operating temperature	70 °C	70 °C
Package body material	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED
encapsulated code	DIP	DIP
Encapsulate equivalent code	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE
power supply	5 V	5 V
Certification status	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	5.08 mm
Nominal supply voltage	5 V	5 V
surface mount	NO	NO
technology	CMOS	CMOS
Telecom integrated circuit types	HDB3 ENCODER/DECODER	HDB3 ENCODER/DECODER
Temperature level	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL
width	7.62 mm	7.62 mm

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