AM29SL800DB-150EF datasheet, PDF

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AM29SL800DB-150EF: Description512KX16 FLASH 1.8V PROM, 150ns, PDSO48, LEAD FREE, MO-142DD, TSOP-48; Categorystorage storage; File Size1MB，49 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/; Environmental Compliance

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AM29SL800DB-150EF Overview

512KX16 FLASH 1.8V PROM, 150ns, PDSO48, LEAD FREE, MO-142DD, TSOP-48

AM29SL800DB-150EF Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SPANSION
Parts packaging code	TSOP1
package instruction	TSSOP,
Contacts	48
Reach Compliance Code	compliant
Maximum access time	150 ns
Spare memory width	8
JESD-30 code	R-PDSO-G48
JESD-609 code	e3
length	18.4 mm
memory density	8388608 bit
Memory IC Type	FLASH
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of terminals	48
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512KX16
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
Programming voltage	1.8 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	2.2 V
Minimum supply voltage (Vsup)	1.65 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	MATTE TIN
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
width	12 mm

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Am29SL800D

Data Sheet

July 2003

The following document specifies Spansion memory products that are now offered by both Advanced

Micro Devices and Fujitsu. Although the document is marked with the name of the company that orig-

inally developed the specification, these products will be offered to customers of both AMD and

Fujitsu.

Continuity of Specifications

There is no change to this datasheet as a result of offering the device as a Spansion product. Any

changes that have been made are the result of normal datasheet improvement and are noted in the

document revision summary, where supported. Future routine revisions will occur when appropriate,

and changes will be noted in a revision summary.

Continuity of Ordering Part Numbers

AMD and Fujitsu continue to support existing part numbers beginning with “Am” and “MBM”. To order

these products, please use only the Ordering Part Numbers listed in this document.

For More Information

Please contact your local AMD or Fujitsu sales office for additional information about Spansion

memory solutions.

Publication Number

27546

Revision

Amendment

Issue Date

April 27, 2005

D a t a

S h e e t

Table of Contents

Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 3

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 5

Special Handling Instructions for FBGA Packages .................. 6

Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 8

Standard Products .................................................................... 8

Device Bus Operations . . . . . . . . . . . . . . . . . . . . 10

Table 1. Am29SL800D Device Bus Operations ..............................10

Table 6. Write Operation Status ..................................................... 25

Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 26

Figure 7. Maximum Negative Overshoot Waveform Maximum

Negative Overshoot Waveform ...................................................... 26

Figure 8. Maximum Positive Overshoot Waveform........................ 26

Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 26

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 27

Table 7. CMOS Compatible ........................................................... 27

Zero Power Flash ................................................................... 28

Figure 9. I

CC1

Current vs. Time (Showing Active and Automatic

Sleep Currents) .............................................................................. 28

Figure 10. Typical I

CC1

vs. Frequency ........................................... 28

Word/Byte Configuration ........................................................ 10

Requirements for Reading Array Data ................................... 10

Writing Commands/Command Sequences ............................ 10

Program and Erase Operation Status .................................... 11

Standby Mode ........................................................................ 11

Automatic Sleep Mode ........................................................... 11

RESET#: Hardware Reset Pin ............................................... 11

Output Disable Mode .............................................................. 12

Table 2. Am29SL800DT Top Boot Block Sector Address Table .....12

Table 3. Am29SL800DB Bottom Boot Block Sector

Address Table .................................................................................13

Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Figure 11. Test Setup..................................................................... 29

Table 8. Test Specifications ........................................................... 29

Table 9. Key to Switching Waveforms ........................................... 29

Figure 12. Input Waveforms and Measurement Levels ................. 29

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 30

Table 10. Read Operations ............................................................ 30

Figure 13. Read Operations Timings ............................................. 30

Table 11. Hardware Reset (RESET#) ............................................ 31

Figure 14. RESET# Timings .......................................................... 31

Table 12. Word/Byte Configuration (BYTE#) ................................. 32

Figure 15. BYTE# Timings for Read Operations............................ 32

Figure 16. BYTE# Timings for Write Operations............................ 32

Table 13. Erase/Program Operations ............................................ 33

Figure 17. Program Operation Timings.......................................... 34

Figure 18. Chip/Sector Erase Operation Timings .......................... 35

Figure 19. Data# Polling Timings (During Embedded Algorithms). 36

Figure 20. Toggle Bit Timings (During Embedded Algorithms)...... 36

Figure 21. DQ2 vs. DQ6................................................................. 37

Table 14. Temporary Sector Unprotect .......................................... 37

Figure 22. Temporary Sector Unprotect Timing Diagram .............. 37

Figure 23. Sector Protect/Unprotect Timing Diagram .................... 38

Table 15. Alternate CE# Controlled Erase/Program Operations .... 39

Figure 24. Alternate CE# Controlled Write Operation Timings ...... 40

Table 16. Erase and Programming Performance ........................... 40

Table 17. Latchup Characteristics .................................................. 41

Table 18. TSOP Pin Capacitance .................................................. 41

Table 19. Data Retention ............................................................... 41

Autoselect Mode ..................................................................... 14

Table 4. Am29SL800D Autoselect Code (High Voltage Method) ...14

Sector Protection/Unprotection ............................................... 14

Temporary Sector Unprotect .................................................. 14

Figure 1. In-System Sector Protect/Unprotect Algorithms .............. 15

Figure 2. Temporary Sector Unprotect Operation........................... 16

Hardware Data Protection ...................................................... 16

Command Definitions . . . . . . . . . . . . . . . . . . . . . 16

Reading Array Data ................................................................ 16

Reset Command ..................................................................... 16

Autoselect Command Sequence ............................................ 17

Word/Byte Program Command Sequence ............................. 17

Figure 3. Program Operation .......................................................... 18

Chip Erase Command Sequence ........................................... 18

Sector Erase Command Sequence ........................................ 18

Erase Suspend/Erase Resume Commands ........................... 19

Figure 4. Erase Operation............................................................... 20

Table 5. Am29SL800D Command Definitions ................................20

Write Operation Status . . . . . . . . . . . . . . . . . . . . 21

DQ7: Data# Polling ................................................................. 21

Figure 5. Data# Polling Algorithm ................................................... 22

RY/BY#: Ready/Busy# ........................................................... 23

DQ6: Toggle Bit I .................................................................... 23

DQ2: Toggle Bit II ................................................................... 23

Reading Toggle Bits DQ6/DQ2 .............................................. 23

Figure 6. Toggle Bit Algorithm......................................................... 24

DQ5: Exceeded Timing Limits ................................................ 24

DQ3: Sector Erase Timer ....................................................... 24

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 42

TS 048–48-Pin Standard TSOP ............................................. 42

TSR048–48-Pin Reverse TSOP ............................................. 43

FBA048–48-Ball Fine-Pitch Ball Grid Array (FBGA)

6 x 8 mm package .................................................................. 44

FBC048 – 48-Ball Fine-Pitch Ball Grid Array (FBGA)

8 x 9 mm package .................................................................. 45

VBK 048 - 48 Ball Fine-Pitch Ball Grid Array (FBGA) ............. 46

8.15 x 6.15 mm ....................................................................... 46

Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 47

Am29SL800D

April 27, 2005

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